中文版 | English

在结果中检索

IMR OpenIR

浏览/检索结果: 共5条，第1-5条 帮助

已选(0)清除 条数/页：   排序方式：
Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces 期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12
作者:  Gao, Zhaoqing;  Wang, Chen;  Gao, Nan;  Guo, Shihao;  Chen, Yinbo;  Chai, Zhenbang;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：107/0  |  提交时间：2022/07/01
Ni-W-graphene coatings  Interfacial reaction barrier  CuGa 2 layer  Ga-21  5In-10Sn liquid alloys  Ni -W solid solution  
Determination of Interfacial Residual Stresses in SiC(f)/Ti-22Al/26Nb Composites Using Raman Spectroscopy 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2011, 卷号: 40, 期号: 9, 页码: 1540-1543
作者:  Xiao Peng;  Wang Yumin;  Lei Jiafeng;  Shi Nanlin;  Yang Rui
收藏  |  浏览/下载：96/0  |  提交时间：2021/02/02
raman  carbon band  interfacial reaction layer  thermal residual stress  finite element analyses  
Determination of Interfacial Residual Stresses in SiC(f)/Ti-22Al/26Nb Composites Using Raman Spectroscopy 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2011, 卷号: 40, 期号: 9, 页码: 1540-1543
作者:  Xiao Peng;  Wang Yumin;  Lei Jiafeng;  Shi Nanlin;  Yang Rui
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
raman  carbon band  interfacial reaction layer  thermal residual stress  finite element analyses  
Joining of Ti-Al-C ceramics by oxidation at low oxygen partial pressure 期刊论文
Journal of the European Ceramic Society, 2009, 卷号: 29, 期号: 12, 页码: 2619-2625
作者:  A. J. Li;  C. F. Hu;  M. S. Li;  Y. C. Zhou
Adobe PDF(1636Kb)  |  收藏  |  浏览/下载：124/0  |  提交时间：2012/04/13
Titanium Aluminum Carbides  Joining  Preferential Oxidation  Al(2)o(3)  Interfacial Layer  Flexural Strength  Liquid Reaction Synthesis  High-temperature  Polycrystalline Ti2alc  Ti3alc2  Behavior  Aluminum  Air  Microstructure  Carbides  Phase  
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(363Kb)  |  收藏  |  浏览/下载：84/0  |  提交时间：2012/04/13
Electromigration  Coupling Effect  Polarity  Intermetallic Compound  Interfacial Reaction  Zn Based Solders  Ni-p/au Layer  Cross-interaction  Intermetallic  Compounds  Bump Metallization  Eutectic Snpb  Sn-9zn Solder  Cu  Joints  Combination