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Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
作者:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
收藏  |  浏览/下载：110/0  |  提交时间：2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Effects of NiSO4 and NaCl contents on throwing power of solution electroplating Ni and Ni deposit 期刊论文
ACTA METALLURGICA SINICA, 2008, 卷号: 44, 期号: 3, 页码: 341-345
作者:  Qu Wensheng;  Zhang Gong;  Lou Langhong;  Dong Jiasheng;  Yang Ke
收藏  |  浏览/下载：75/0  |  提交时间：2021/02/02
electrical conductivity  throwing power  Ni deposit  preferred orientation