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Prediction and formation mechanism of serrated chips in cutting of SA508-3 steel under enhanced cooling and lubrication environments 期刊论文
TRIBOLOGY INTERNATIONAL, 2024, 卷号: 200, 页码: 17
作者:  Wang, Qinqiang;  Zhao, Yong;  Zhang, Chao;  Xu, Haojie;  Xu, Bin;  Wei, Zhaocheng;  Kang, Chengwei;  Li, Dianzhong;  Guo, Jiang
收藏  |  浏览/下载：6/0  |  提交时间：2025/04/27
SA508-3 steel  Lubrication conditions  Critical cutting condition  Chip morphology  Material removal mechanism  
One-step fabrication of a self-driven point-of-care chip by femtosecond laser direct writing and its application in cancer cell H2O2 detection via semiconductor-based SERS 期刊论文
TALANTA, 2024, 卷号: 278, 页码: 10
作者:  Wang, Yue;  Lai, Bo;  Yu, Zhi;  Xu, Zhangrun
收藏  |  浏览/下载：5/0  |  提交时间：2025/04/27
Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding 期刊论文
ARCHIVES OF CIVIL AND MECHANICAL ENGINEERING, 2024, 卷号: 24, 期号: 4, 页码: 19
作者:  Yin, Guoqiang;  Liang, Hongrui;  Wang, Dong;  Liu, Zeyu;  Zhou, Yunguang
收藏  |  浏览/下载：7/0  |  提交时间：2025/04/27
SiCp/Al composites  3D simulation  Single diamond grain  Removal mechanism  Surface/Subsurface damage  
Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 卷号: 35, 期号: 13, 页码: 15
作者:  Yao, Jinye;  Shang, Min;  Chen, Xiangxu;  Xing, Jing;  Guo, Tianhao;  Wang, Yunpeng;  Ma, Haitao;  Gao, Zhaoqing
收藏  |  浏览/下载：10/0  |  提交时间：2025/04/27
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：10/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Accelerating the design of multicomponent rare earth silicates for SiCf /SiC CMC by combinatorial material chip design and high throughput screening 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2023, 卷号: 150, 页码: 96-103
作者:  Lv, Xirui;  Lei, Yiming;  Zhang, Zhao;  Zhang, Jie;  Wang, Jingyang
收藏  |  浏览/下载：15/0  |  提交时间：2024/01/07
High throughput experimentation  RE silicates  Phase stability  Mechanical properties  
Three-dimensional transistors and integration based on low-dimensional materials for the post-Moore's law era 期刊论文
MATERIALS TODAY, 2023, 卷号: 63, 页码: 170-187
作者:  Wang, Xiaoyue;  Liu, Chi;  Wei, Yuning;  Feng, Shun;  Sun, Dongming;  Cheng, Huiming
收藏  |  浏览/下载：11/0  |  提交时间：2024/01/07
Field-effect transistors  Three-dimensional integration  Low-dimensional materials  Carbon nanotubes  post-Moore's law era  
Milling Mechanism and Surface Quality of 20% Volume Fraction SiCp/Al Materials Treated by Natural Aging 期刊论文
SILICON, 2022, 页码: 14
作者:  Zhang, Ke;  Gao, Qi;  Wang, Quanzhao
收藏  |  浏览/下载：32/0  |  提交时间：2023/05/09
SiCp  Al2009 composite  Milling mechanism  Surface quality  Milling simulation  Optimization of milling parameters  
Milling Mechanism and Surface Quality of 20% Volume Fraction SiCp/Al Materials Treated by Natural Aging 期刊论文
SILICON, 2022, 页码: 14
作者:  Zhang, Ke;  Gao, Qi;  Wang, Quanzhao
收藏  |  浏览/下载：35/0  |  提交时间：2023/05/09
SiCp  Al2009 composite  Milling mechanism  Surface quality  Milling simulation  Optimization of milling parameters  
High-performance gold/graphene/germanium photodetector based on a graphene-on-germanium wafer 期刊论文
NANOTECHNOLOGY, 2022, 卷号: 33, 期号: 34, 页码: 7
作者:  Jiang, Haiyan;  Li, Bo;  Wei, Yuning;  Feng, Shun;  Di, Zengfeng;  Xue, Zhongying;  Sun, Dongming;  Liu, Chi
收藏  |  浏览/下载：122/0  |  提交时间：2022/07/14
graphene  germanium  2D material  Fermi-level pinning  photodetector