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Electromigration anisotropy introduced by tin orientation in solder joints
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Authors:
Chen, Jian-Qiang
;
Liu, Kai-Lang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
;
Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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Submit date：2017/08/17
Electromigration
Single Crystal Tin
Cu6sn5
Intermetallic Compounds
Orientation
Diffusion
