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Microstructure Evolution and Tensile Properties of the Alx(CoCrNi)100-x Medium-Entropy Alloys 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2023, 页码: 13
Authors:  Zou, Ji-Peng;  Luo, Xue-Mei;  Zhang, Bin;  Liu, Guo-Dong;  Chen, Hong-Lei;  Zhu, Xiao-Fei;  Yang, Wen-Ke;  Zhang, Guang-Ping
Favorite  |  View/Download：11/0  |  Submit date：2024/01/07
Medium-entropy alloys  Microstructures  Tensile properties  Strengthening mechanisms  
Two-dimensional superconducting MoSi2N4(MoN)(4n) homologous compounds 期刊论文
NATIONAL SCIENCE REVIEW, 2022, 页码: 8
Authors:  Liu, Zhibo;  Wang, Lei;  Hong, Yi-Lun;  Chen, Xing-Qiu;  Cheng, Hui-Ming;  Ren, Wencai
Favorite  |  View/Download：57/0  |  Submit date：2023/05/09
MoSi2N4  2D layered materials  homologous compounds  iDPC-STEM  superconductivity  
Progress in ceramic materials and structure design toward advanced thermal barrier coatings 期刊论文
Journal of Advanced Ceramics, 2022, 卷号: 11, 期号: 7
Authors:  Wei,Zhi-Yuan;  Meng,Guo-Hui;  Chen,Lin;  Li,Guang-Rong;  Liu,Mei-Jun;  Zhang,Wei-Xu;  Zhao,Li-Na;  Zhang,Qiang;  Zhang,Xiao-Dong;  Wan,Chun-Lei;  Qu,Zhi-Xue;  Chen,Lin;  Feng,Jing;  Liu,Ling;  Dong,Hui;  Bao,Ze-Bin;  Zhao,Xiao-Feng;  Zhang,Xiao-Feng;  Guo,Lei;  Wang,Liang;  Cheng,Bo;  Zhang,Wei-Wei;  Xu,Peng-Yun;  Yang,Guan-Jun;  Cai,Hong-Neng;  Cui,Hong;  Wang,You;  Ye,Fu-Xing;  Ma,Zhuang;  Pan,Wei;  Liu,Min;  Zhou,Ke-Song;  Li,Chang-Jiu
Favorite  |  View/Download：129/0  |  Submit date：2022/07/14
thermal barrier coatings (TBCs)  ceramic material  degradation and failure  structure design  long lifetime  
Enhancing bending fatigue resistance of the CoCrFeMnNi high-entropy alloy thin foils by Al addition 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 831, 页码: 11
Authors:  Zou, Ji-Peng;  Luo, Xue-Mei;  Zhang, Bin;  Luo, Yan-Wen;  Chen, Hong-Lei;  Liang, Fei;  Zhang, Guang-Ping
Favorite  |  View/Download：176/0  |  Submit date：2022/01/27
High-entropy alloys  Fatigue  Slip irreversibility  Deformation mechanisms  
Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 89, 页码: 107-113
Authors:  Chen, Hong-Lei;  Luo, Xue-Mei;  Wang, Dong;  Schaaf, Peter;  Zhang, Guang-Ping
Favorite  |  View/Download：155/0  |  Submit date：2021/11/22
Thin films  Ti interlayer  Fatigue  Extrusion  Interface  
Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 89, 页码: 107-113
Authors:  Chen, Hong-Lei;  Luo, Xue-Mei;  Wang, Dong;  Schaaf, Peter;  Zhang, Guang-Ping
Favorite  |  View/Download：146/0  |  Submit date：2021/11/22
Thin films  Ti interlayer  Fatigue  Extrusion  Interface  
Intercalated architecture of MA(2)Z(4) family layered van der Waals materials with emerging topological, magnetic and superconducting properties 期刊论文
NATURE COMMUNICATIONS, 2021, 卷号: 12, 期号: 1, 页码: 10
Authors:  Wang, Lei;  Shi, Yongpeng;  Liu, Mingfeng;  Zhang, Ao;  Hong, Yi-Lun;  Li, Ronghan;  Gao, Qiang;  Chen, Mingxing;  Ren, Wencai;  Cheng, Hui-Ming;  Li, Yiyi;  Chen, Xing-Qiu
Favorite  |  View/Download：138/0  |  Submit date：2021/10/15
A unified model for determining fracture strain of metal films on flexible substrates 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 54, 页码: 87-94
Authors:  Wu, Xu-Ping;  Luo, Xue-Mei;  Chen, Hong-Lei;  Zou, Ji-Peng;  Zhang, Guang-Ping
Favorite  |  View/Download：123/0  |  Submit date：2021/02/02
Thin films  Fracture  Electrical resistance  Microstructure  Flexible substrate  
Chemical vapor deposition of layered two-dimensional MoSi2N4 materials 期刊论文
SCIENCE, 2020, 卷号: 369, 期号: 6504, 页码: 670-+
Authors:  Hong, Yi-Lun;  Liu, Zhibo;  Wang, Lei;  Zhou, Tianya;  Ma, Wei;  Xu, Chuan;  Feng, Shun;  Chen, Long;  Chen, Mao-Lin;  Sun, Dong-Ming;  Chen, Xing-Qiu;  Cheng, Hui-Ming;  Ren, Wencai
Favorite  |  View/Download：166/0  |  Submit date：2021/02/02
Chemical vapor deposition of layered two-dimensional MoSi2N4 materials 期刊论文
SCIENCE, 2020, 卷号: 369, 期号: 6504, 页码: 670-+
Authors:  Hong, Yi-Lun;  Liu, Zhibo;  Wang, Lei;  Zhou, Tianya;  Ma, Wei;  Xu, Chuan;  Feng, Shun;  Chen, Long;  Chen, Mao-Lin;  Sun, Dong-Ming;  Chen, Xing-Qiu;  Cheng, Hui-Ming;  Ren, Wencai
Favorite  |  View/Download：168/0  |  Submit date：2021/02/02