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Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
Authors:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
Favorite  |  View/Download:1/0  |  Submit date:2021/02/02
SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism