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Bioactive coating on a new Mg-2Zn-0.5Nd alloy: modulation of degradation rate and cellular response 期刊论文
MATERIALS TECHNOLOGY, 2019, 卷号: 34, 期号: 7, 页码: 394-402
Authors:  Patil, Sachin S.;  Misra, R. D. K.;  Gao, M.;  Ma, Z.;  Tan, L.;  Yang, K.
Favorite  |  View/Download:1/0  |  Submit date:2020/01/06
Magnesium alloy  bioactivity  calcium phosphate  apatite  metal implants  
TiAl合金表面搪瓷基复合涂层与多弧离子镀NiCrAlY涂层的抗热腐蚀行为对比研究 期刊论文
金属学报, 2019, 卷号: 55, 期号: 02, 页码: 229-237
Authors:  廖依敏;  丰敏;  陈明辉;  耿哲;  刘阳;  王福会;  朱圣龙
Favorite  |  View/Download:4/0  |  Submit date:2020/01/06
搪瓷涂层  热腐蚀  NiCrAlY涂层  TiAl合金  
缝隙腐蚀对Fe-30Mn-1C合金降解速率的影响 期刊论文
金属学报, 2018, 卷号: 54, 期号: 07, 页码: 1010-1018
Authors:  马政;  陆喜;  高明;  谭丽丽;  杨柯
Favorite  |  View/Download:5/0  |  Submit date:2018/12/25
铁基合金  可降解  缝隙腐蚀  心血管支架  
Nano-scale precipitates: The key to high strength and high conductivity in Al alloy wire 期刊论文
ELSEVIER SCI LTD, 2017, 卷号: 132, 页码: 148-157
Authors:  Hou, J. P.;  Wang, Q.;  Zhang, Z. J.;  Tian, Y. Z.;  Wu, X. M.;  Yang, H. J.;  Li, X. W.;  Zhang, Z. F.;  Wang, Q;  Zhang, ZF (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
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Aluminum Alloys  Precipitation  Electrical Conductivity  Strength  
Hot corrosion behaviour of single-phase platinum-modified aluminide coatings: Effect of Pt content and pre-oxidation 期刊论文
PERGAMON-ELSEVIER SCIENCE LTD, 2017, 卷号: 127, 页码: 82-90
Authors:  Yang, Y. F.;  Jiang, C. Y.;  Zhang, Z. Y.;  Bao, Z. B.;  Chen, M. H.;  Zhu, S. L.;  Wang, F. H.;  Bao, ZB (reprint author), Chinese Acad Sci, Inst Met Res, Lab Corros & Protect, Wencui Rd 62, Shenyang 110016, Liaoning, Peoples R China.;  Chen, MH (reprint author), Northeastern Univ, Sch Mat Sci & Engn, Wenhua Rd 3, Shenyang 110819, Liaoning, Peoples R China.
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Platinum  Metal Coatings  Sem  Epma  Hot Corrosion  
Direct observation of solute interstitials and their clusters in Mg alloys 期刊论文
MATERIALS CHARACTERIZATION, 2017, 卷号: 128, 页码: 226-231
Authors:  Yang, Z. Q.;  Ma, S. Y.;  Hu, Q. M.;  Ye, H. Q.;  Chisholm, M. F.;  Yang, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China.
Favorite  |  View/Download:35/0  |  Submit date:2017/08/17
Interstitial  Crowdion  Dumbbell  Aberration-corrected Electron Microscopy  Density Functional Theory  
Effect of beta (110) texture intensity on alpha-variant selection and microstructure morphology during beta -> alpha phase transformation in near alpha titanium alloy 期刊论文
ACTA MATERIALIA, 2017, 卷号: 126, 页码: 372-382
Authors:  Zhao, Z. B.;  Wang, Q. J.;  Hu, Q. M.;  Liu, J. R.;  Yu, B. B.;  Yang, R.;  Wang, QJ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Favorite  |  View/Download:66/0  |  Submit date:2017/08/17
Titanium Alloy  Variant Selection  Microstructure Morphology  Ebsd  Texture  
Influence of thermal exposure on microstructure evolution and tensile fracture behaviors of compacted graphite iron 期刊论文
Authors:  Qiu, Y.;  Pang, J. C.;  Li, S. X.;  Yang, E. N.;  Fu, W. Q.;  Liang, M. X.;  Zhang, Z. F.;  Pang, JC;  Zhang, ZF (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China.
Favorite  |  View/Download:81/0  |  Submit date:2016/08/22
Compacted Graphite Iron  Thermal Exposure  In-situ Tensile Testing  Microstructure Evolution  Fracture Mechanism  
Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces 期刊论文
ACTA MATERIALIA, 2016, 卷号: 104, 页码: 1-8
Authors:  Zhang, Z. H.;  Li, M. Y.;  Liu, Z. Q.;  Yang, S. H.;;
Favorite  |  View/Download:71/0  |  Submit date:2016/04/21
Intermetallic Compounds  Microstructure Formation Mechanism  Cu Single Crystal  Orientation  Soldering  
Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint 期刊论文
Journal of Applied Physics, 2015, 卷号: 117, 期号: 1
Authors:  L. M.;  Zhang Yang, Z. F.
Favorite  |  View/Download:69/0  |  Submit date:2015/05/08
Ag-cu Solder  Growth  Behaviors  Packages  Lead