IMR OpenIR
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
Jiang, Lin1,2; Zhang, Liang1,3; Liu, Zhi-Quan1,2
Corresponding AuthorLiu, Zhi-Quan(zqliu@imr.ac.cn)
2019-11-01
Source PublicationACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN1006-7191
Volume32Issue:11Pages:1407-1414
AbstractTarget assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m(2) K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.
KeywordCo target assembly Solder Residual stress Simulation Taguchi method Optimal design
Funding OrganizationNational Key R&D Program of China ; National Natural Science Foundation of China ; China Postdoctoral Science Foundation
DOI10.1007/s40195-019-00875-6
Indexed BySCI
Language英语
Funding ProjectNational Key R&D Program of China[2017YFB0305501] ; National Natural Science Foundation of China[51475220] ; China Postdoctoral Science Foundation[2016M591464]
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000488930700011
PublisherCHINESE ACAD SCIENCES, INST METAL RESEARCH
Citation statistics
Cited Times:3[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/135801
Collection中国科学院金属研究所
Corresponding AuthorLiu, Zhi-Quan
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 11016, Liaoning, Peoples R China
3.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China
Recommended Citation
GB/T 7714
Jiang, Lin,Zhang, Liang,Liu, Zhi-Quan. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2019,32(11):1407-1414.
APA Jiang, Lin,Zhang, Liang,&Liu, Zhi-Quan.(2019).Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method.ACTA METALLURGICA SINICA-ENGLISH LETTERS,32(11),1407-1414.
MLA Jiang, Lin,et al."Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method".ACTA METALLURGICA SINICA-ENGLISH LETTERS 32.11(2019):1407-1414.
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