| Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method | |
| Jiang, Lin1,2; Zhang, Liang1,3; Liu, Zhi-Quan1,2 | |
| Corresponding Author | Liu, Zhi-Quan(zqliu@imr.ac.cn) |
| 2019-11-01 | |
| Source Publication | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| ISSN | 1006-7191 |
| Volume | 32Issue:11Pages:1407-1414 |
| Abstract | Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m(2) K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly. |
| Keyword | Co target assembly Solder Residual stress Simulation Taguchi method Optimal design |
| Funding Organization | National Key R&D Program of China ; National Natural Science Foundation of China ; China Postdoctoral Science Foundation |
| DOI | 10.1007/s40195-019-00875-6 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305501] ; National Natural Science Foundation of China[51475220] ; China Postdoctoral Science Foundation[2016M591464] |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000488930700011 |
| Publisher | CHINESE ACAD SCIENCES, INST METAL RESEARCH |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/135804 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 11016, Liaoning, Peoples R China 3.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China |
| Recommended Citation GB/T 7714 | Jiang, Lin,Zhang, Liang,Liu, Zhi-Quan. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2019,32(11):1407-1414. |
| APA | Jiang, Lin,Zhang, Liang,&Liu, Zhi-Quan.(2019).Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method.ACTA METALLURGICA SINICA-ENGLISH LETTERS,32(11),1407-1414. |
| MLA | Jiang, Lin,et al."Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method".ACTA METALLURGICA SINICA-ENGLISH LETTERS 32.11(2019):1407-1414. |
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