The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

doi:10.1007/s10854-018-9508-z

IMR OpenIR

	The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding
	Du, Yahong 1,2; Liu, Zhi-Quan 1,2; Ji, Hongjun 3; Li, Mingyu 3; Wen, Ming 4
通讯作者	Liu, Zhi-Quan(zqliu@imr.ac.cn) ; Wen, Ming(wen@ipm.com.cn)
	2018-08-01
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	29 期号:16 页码:13774-13781
摘要	The palladium (Pd) distribution over the free air ball (FAB) and its effect on the ball's shear strength were investigated in the Pd-coated copper (Cu) wire bonding process. It was found that for the same FAB/wire diameter ratio of 1.5, the bigger the electrical flame-off (EFO) current was, the larger would be the exposed Cu regions over FAB without Pd distribution. Combining experimental observations, a model of Pd distribution over FAB was first proposed by changing the EFO current and firing time. As the firing time increased, the coated Pd element could be dissolved into the Cu base to form a PdCu alloy at the FAB surface, to protect the bonded ball from corrosion. The Pd-coated Cu wire has higher bonding shear strength than the bare Cu wire. However, the FAB with the largest Pd coverage had the smallest ball shear strength, which revealed that the control of Pd distribution over FAB is very critical for a high-quality bonding interface.
资助者	National Key R&D Program of China ; National Natural Science Foundation of China ; State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals
DOI	10.1007/s10854-018-9508-z
收录类别	SCI
语种	英语
资助项目	National Key R&D Program of China[2017YFB0305700] ; National Natural Science Foundation of China[51564025] ; State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals[SKL-SPM-201803]
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000439338500038
出版者	SPRINGER
引用统计	被引频次：8[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/135906
专题	中国科学院金属研究所
通讯作者	Liu, Zhi-Quan; Wen, Ming
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China 3.Harbin Inst Technol Shenzhen, State Key Lab Adv Welding & Joining, Shenzhen 518055, Peoples R China 4.Kunming Inst Precious Met, Kunming 650106, Yunnan, Peoples R China
推荐引用方式 GB/T 7714	Du, Yahong,Liu, Zhi-Quan,Ji, Hongjun,et al. The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(16):13774-13781.
APA	Du, Yahong,Liu, Zhi-Quan,Ji, Hongjun,Li, Mingyu,&Wen, Ming.(2018).The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(16),13774-13781.
MLA	Du, Yahong,et al."The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.16(2018):13774-13781.