| Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging | |
| Tian, Feifei1,2; Pang, Xueyong3; Xu, Bo1; Liu, Zhi-Quan2,4 | |
| Corresponding Author | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 2020-01-02 | |
| Source Publication | JOURNAL OF ELECTRONIC MATERIALS
 |
| ISSN | 0361-5235 |
| Volume | 49Issue:4Pages:9 |
| Abstract | Evolution of Cu-2(In,Sn) formed between In-48Sn solder and polycrystalline Cu during long-time liquid-state aging was systematically investigated. During aging at 160 degrees C up to 90 min, one IMC species, Cu-2(In,Sn) was found, which showed two different morphologies, a coarse-grained Cu-2(In,Sn) sublayer and a fine-grained Cu2(In,Sn) sublayer. The fine Cu-2(In,Sn) grains had and always kept a granular morphology without any growth orientation. The morphology of coarse Cu-2(In,Sn) grains evolved from poly-facet pyramidal-type without preferential orientation into hexagonal structure preferring only one elongated direction after aging up to 90 min. Electron beam backscattered diffraction revealed that coarse-grain Cu-2(In,Sn) compound grew along [0001] axis and exposed {11-20} crystal planes. Growth mechanism of coarse Cu-2(In,Sn) grains related closely to thermodynamic stability of hexagonal structure, which drove by reduction of surface energy from higher to lower, and first principles calculations verified that {11-20} crystal planes had the lowest surface energy. Fine Cu-2(In,Sn) grains had a special growth mechanism at the root of coarse Cu-2(In,Sn) grains compared to normal fine Cu-2(In,Sn) grains underneath coarse Cu-2(In,Sn) grains. |
| Keyword | In-48Sn solder polycrystalline Cu Cu-2(In Sn) growth orientation |
| Funding Organization | National Key R&D Program of China ; fundamental research funds for the Central Universities |
| DOI | 10.1007/s11664-019-07909-w |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305700] ; fundamental research funds for the Central Universities[N160208001] |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied |
| WOS ID | WOS:000505344800016 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/136509 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Nanjing Elect Devices Inst, Nanjing 210016, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Northeastern Univ, Sch Mat Sci & Engn, Shenyang 110819, Liaoning, Peoples R China 4.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Guangdong, Peoples R China |
| Recommended Citation GB/T 7714 | Tian, Feifei,Pang, Xueyong,Xu, Bo,et al. Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging[J]. JOURNAL OF ELECTRONIC MATERIALS,2020,49(4):9. |
| APA | Tian, Feifei,Pang, Xueyong,Xu, Bo,&Liu, Zhi-Quan.(2020).Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging.JOURNAL OF ELECTRONIC MATERIALS,49(4),9. |
| MLA | Tian, Feifei,et al."Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging".JOURNAL OF ELECTRONIC MATERIALS 49.4(2020):9. |
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