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Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating
Gao, Li-Yin1,2; Wan, Peng2; Liu, Zhi-Quan1,2
Corresponding AuthorLiu, Zhi-Quan(zqliu@siat.ac.cn)
2020-03-15
Source PublicationJOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
ISSN0304-8853
Volume498Pages:6
AbstractIn order to investigate the performance of Fe-Ni magnetic cores within embedded inductor in 3D package, a series of Fe-Ni films with compositions ranging from 15 wt% to 80 wt% iron were electrodeposited on 8-inch silicon wafer. The uniformity on brightness, phase structure and grain size of Fe-Ni magnetic films were investigated through SEM (scanning electron microscopy) and XRD (X-ray diffraction). A gradient growth behavior of fcc (face-centered cubic) and bcc (body-centered cubic) phase was revealed when Fe content ranges 50-75 wt % within Fe-Ni films, which can be attributed to the slightly faster growth rate of fcc phase. As also revealed in TEM (transmission electron microscope) observation, the fcc phase gradually spread over bcc phase region during the electroplating process, and formed an interface with a slight tilt angle to the substrate on the thickness direction. Several methods, such as increasing solution stirring, temperature or decreasing the current density, were proposed to restrain the gradient growth behavior of Fe-Ni film in wafer level.
KeywordFe-Ni Electrodeposition Transmission electron microscopy (TEM) Interfacial structure
Funding OrganizationMajor National Science and Technology Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)
DOI10.1016/j.jmmm.2019.166131
Indexed BySCI
Language英语
Funding ProjectMajor National Science and Technology Program of China[2011ZX02602] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934]
WOS Research AreaMaterials Science ; Physics
WOS SubjectMaterials Science, Multidisciplinary ; Physics, Condensed Matter
WOS IDWOS:000504845300064
PublisherELSEVIER
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/136537
Collection中国科学院金属研究所
Corresponding AuthorLiu, Zhi-Quan
Affiliation1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Guangdong, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
Recommended Citation
GB/T 7714
Gao, Li-Yin,Wan, Peng,Liu, Zhi-Quan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating[J]. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,2020,498:6.
APA Gao, Li-Yin,Wan, Peng,&Liu, Zhi-Quan.(2020).Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating.JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,498,6.
MLA Gao, Li-Yin,et al."Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating".JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS 498(2020):6.
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