| Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating | |
| Gao, Li-Yin1,2; Wan, Peng2; Liu, Zhi-Quan1,2 | |
| Corresponding Author | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 2020-03-15 | |
| Source Publication | JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
 |
| ISSN | 0304-8853 |
| Volume | 498Pages:6 |
| Abstract | In order to investigate the performance of Fe-Ni magnetic cores within embedded inductor in 3D package, a series of Fe-Ni films with compositions ranging from 15 wt% to 80 wt% iron were electrodeposited on 8-inch silicon wafer. The uniformity on brightness, phase structure and grain size of Fe-Ni magnetic films were investigated through SEM (scanning electron microscopy) and XRD (X-ray diffraction). A gradient growth behavior of fcc (face-centered cubic) and bcc (body-centered cubic) phase was revealed when Fe content ranges 50-75 wt % within Fe-Ni films, which can be attributed to the slightly faster growth rate of fcc phase. As also revealed in TEM (transmission electron microscope) observation, the fcc phase gradually spread over bcc phase region during the electroplating process, and formed an interface with a slight tilt angle to the substrate on the thickness direction. Several methods, such as increasing solution stirring, temperature or decreasing the current density, were proposed to restrain the gradient growth behavior of Fe-Ni film in wafer level. |
| Keyword | Fe-Ni Electrodeposition Transmission electron microscopy (TEM) Interfacial structure |
| Funding Organization | Major National Science and Technology Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission) |
| DOI | 10.1016/j.jmmm.2019.166131 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | Major National Science and Technology Program of China[2011ZX02602] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934] |
| WOS Research Area | Materials Science ; Physics |
| WOS Subject | Materials Science, Multidisciplinary ; Physics, Condensed Matter |
| WOS ID | WOS:000504845300064 |
| Publisher | ELSEVIER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/136540 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Guangdong, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China |
| Recommended Citation GB/T 7714 | Gao, Li-Yin,Wan, Peng,Liu, Zhi-Quan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating[J]. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,2020,498:6. |
| APA | Gao, Li-Yin,Wan, Peng,&Liu, Zhi-Quan.(2020).Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating.JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,498,6. |
| MLA | Gao, Li-Yin,et al."Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating".JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS 498(2020):6. |
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