Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating

doi:10.1016/j.jmmm.2019.166131

IMR OpenIR

	Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating
	Gao, Li-Yin 1,2; Wan, Peng 2; Liu, Zhi-Quan 1,2
通讯作者	Liu, Zhi-Quan(zqliu@siat.ac.cn)
	2020-03-15
发表期刊	JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
ISSN	0304-8853
卷号	498 页码:6
摘要	In order to investigate the performance of Fe-Ni magnetic cores within embedded inductor in 3D package, a series of Fe-Ni films with compositions ranging from 15 wt% to 80 wt% iron were electrodeposited on 8-inch silicon wafer. The uniformity on brightness, phase structure and grain size of Fe-Ni magnetic films were investigated through SEM (scanning electron microscopy) and XRD (X-ray diffraction). A gradient growth behavior of fcc (face-centered cubic) and bcc (body-centered cubic) phase was revealed when Fe content ranges 50-75 wt % within Fe-Ni films, which can be attributed to the slightly faster growth rate of fcc phase. As also revealed in TEM (transmission electron microscope) observation, the fcc phase gradually spread over bcc phase region during the electroplating process, and formed an interface with a slight tilt angle to the substrate on the thickness direction. Several methods, such as increasing solution stirring, temperature or decreasing the current density, were proposed to restrain the gradient growth behavior of Fe-Ni film in wafer level.
关键词	Fe-Ni Electrodeposition Transmission electron microscopy (TEM) Interfacial structure
资助者	Major National Science and Technology Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)
DOI	10.1016/j.jmmm.2019.166131
收录类别	SCI
语种	英语
资助项目	Major National Science and Technology Program of China[2011ZX02602] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934]
WOS研究方向	Materials Science ; Physics
WOS类目	Materials Science, Multidisciplinary ; Physics, Condensed Matter
WOS记录号	WOS:000504845300064
出版者	ELSEVIER
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/136540
专题	中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Guangdong, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
推荐引用方式 GB/T 7714	Gao, Li-Yin,Wan, Peng,Liu, Zhi-Quan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating[J]. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,2020,498:6.
APA	Gao, Li-Yin,Wan, Peng,&Liu, Zhi-Quan.(2020).Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating.JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS,498,6.
MLA	Gao, Li-Yin,et al."Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating".JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS 498(2020):6.