Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling

doi:10.1016/j.microrel.2019.05.015

IMR OpenIR

	Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
	Li, Qi-hai 1; Li, Cai-Fu 3,4; Zhang, Wei 1; Chen, Wei-wei 1; Liu, Zhi-Qua 2,3
通讯作者	Liu, Zhi-Qua(zqliu@siat.ac.cn)
	2019-08-01
发表期刊	MICROELECTRONICS RELIABILITY
ISSN	0026-2714
卷号	99 页码:12-18
摘要	To clarify the mechanism leading to solder joint failure easily in multi-field conditions in electronics system, the microstructural evolution of 62Sn36Pb2Ag/Cu solder joint during thermal cycling was investigated precisely using scanning electron microscopy and transmission electron microscopy. It was found that the as-reflowed microstructure of the solder joint was compact and uniform, being consist of Sn, Pb and Ag3Sn phases within original solder and Cu6Sn5 compound at the interface to Cu substrate. Addition of 2 wt% Ag resulted in isolated Ag3Sn particles (0.2-0.5 mu m in diameter) distributed in Sn matrix of the solder joint. During thermal cycling process, the microstructure of solder became more and more coarsening, especially the average diameter of Pb particles increased to more than 3.5 times larger after 2500 thermal cycles. Moreover, Cu3Sn was generated at Cu6Sn5/Cu interface, and the total thickness of IMC layer increases almost linearly with the number of cycles. Due to the difference in coefficients of thermal expansion (CTE) among PCB board, Cu substrate and solder alloy, thermal mismatch occurred and contributed to the microstructural coarsening of solder alloy. Furthermore, due to the difference of expansion and contraction between Pb phase and Sn phase in the solder, cracks were formed and propagated along the interface between these two phases, which can accumulate and result in final failure of the solder joint thoroughly.
关键词	62Sn36Pb2Ag solder joint Microstructural evolution Failure analysis Intermetallic compound (IMC) Thermal cycling
资助者	National Key Research and Development Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission) ; Institute of Electronic Engineering Foundation of CAEP
DOI	10.1016/j.microrel.2019.05.015
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Program of China[2017YFB0305700] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934] ; Institute of Electronic Engineering Foundation of CAEP
WOS研究方向	Engineering ; Science & Technology - Other Topics ; Physics
WOS类目	Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied
WOS记录号	WOS:000496833600002
出版者	PERGAMON-ELSEVIER SCIENCE LTD
引用统计	被引频次：19[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/136834
专题	中国科学院金属研究所
通讯作者	Liu, Zhi-Qua
作者单位	1.China Acad Engn Phys, Inst Elect Engn, Mianyang 621900, Sichuan, Peoples R China 2.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Guangdong, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 4.Sun Yat Sen Univ, Sch Mat, State Key Lab Optoelect Mat & Technol, Guangzhou 510275, Guangdong, Peoples R China
推荐引用方式 GB/T 7714	Li, Qi-hai,Li, Cai-Fu,Zhang, Wei,et al. Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling[J]. MICROELECTRONICS RELIABILITY,2019,99:12-18.
APA	Li, Qi-hai,Li, Cai-Fu,Zhang, Wei,Chen, Wei-wei,&Liu, Zhi-Qua.(2019).Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling.MICROELECTRONICS RELIABILITY,99,12-18.
MLA	Li, Qi-hai,et al."Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling".MICROELECTRONICS RELIABILITY 99(2019):12-18.