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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
Favorite  |  View/Download:1/0  |  Submit date:2020/01/06
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
Authors:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
Favorite  |  View/Download:49/0  |  Submit date:2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process 期刊论文
Microelectronics Reliability, 2013, 卷号: 53, 期号: 6, 页码: 899-905
Authors:  P. J. Shang;  L. Zhang;  Z. Q. Liu;  J. Tan;  J. K. Shang
Favorite  |  View/Download:112/0  |  Submit date:2013/12/24
Mechanical-properties  Joints  Copper  Morphology  Tin  
Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
Authors:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
Favorite  |  View/Download:272/0  |  Submit date:2012/04/13
Crack-growth-behavior  Lead-free Solders  Alpha-al2o3(0001)/cu(111)  Interface  Mechanical Strength  Reactive Interface  Molecular-dynamics  Joints  Cu3sn  Cu  1st-principles  
Tin whisker growth on bulk Sn-Pb eutectic doping with Nd 期刊论文
Microelectronics Reliability, 2009, 卷号: 49, 期号: 6, 页码: 667-672
Authors:  M. Liu;  A. P. Xian
Adobe PDF(530Kb)  |  Favorite  |  View/Download:334/170  |  Submit date:2012/04/13
Free Solder Alloys  Surface  Cu  Joints  
Whisker growth on tin finishes of different electrolytes 期刊论文
Microelectronics Reliability, 2008, 卷号: 48, 期号: 1, 页码: 105-110
Authors:  B. Jiang;  A. P. Man
Adobe PDF(537Kb)  |  Favorite  |  View/Download:231/110  |  Submit date:2012/04/13
Fatigue and thermal fatigue damage analysis of thin metal films 期刊论文
Microelectronics Reliability, 2007, 卷号: 47, 期号: 12, 页码: 2007-2013
Authors:  G. P. Zhang;  C. A. Volkert;  R. Schwaiger;  R. Monig;  O. Kraft
Favorite  |  View/Download:188/0  |  Submit date:2012/04/13
High-cycle Fatigue  Copper-films  Mechanical-properties  Behavior  Size  Deformation  Specimens  Tension