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Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
Authors:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
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Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process 期刊论文
Microelectronics Reliability, 2013, 卷号: 53, 期号: 6, 页码: 899-905
Authors:  P. J. Shang;  L. Zhang;  Z. Q. Liu;  J. Tan;  J. K. Shang
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Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
Authors:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
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Tin whisker growth on bulk Sn-Pb eutectic doping with Nd 期刊论文
Microelectronics Reliability, 2009, 卷号: 49, 期号: 6, 页码: 667-672
Authors:  M. Liu;  A. P. Xian
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Whisker growth on tin finishes of different electrolytes 期刊论文
Microelectronics Reliability, 2008, 卷号: 48, 期号: 1, 页码: 105-110
Authors:  B. Jiang;  A. P. Man
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Fatigue and thermal fatigue damage analysis of thin metal films 期刊论文
Microelectronics Reliability, 2007, 卷号: 47, 期号: 12, 页码: 2007-2013
Authors:  G. P. Zhang;  C. A. Volkert;  R. Schwaiger;  R. Monig;  O. Kraft
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