IMR OpenIR

Browse/Search Results:  1-10 of 58 Help

Selected(0)Clear Items/Page:    Sort:
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
Favorite  |  View/Download:1/0  |  Submit date:2020/01/06
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
Authors:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
Favorite  |  View/Download:3/0  |  Submit date:2020/01/06
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing 期刊论文
CORROSION SCIENCE, 2018, 卷号: 139, 页码: 383-394
Authors:  Wang, J;  Chen, G;  Sun, FL;  Zhou, ZX;  Liu, ZQ;  Liu, CQ
Favorite  |  View/Download:3/0  |  Submit date:2018/12/25
Electronic materials  Intermetallics  Metal coatings  Tin  STEM  Oxidation  
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
Authors:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Favorite  |  View/Download:17/0  |  Submit date:2018/06/05
Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth  
The nucleation and growth mechanism of Ni-Sn eutectic in a single crystal superalloy 期刊论文
ELSEVIER SCIENCE BV, 2017, 卷号: 479, 页码: 75-82
Authors:  Jiang, Weiguo;  Wang, Li;  Li, Xiangwei;  Lou, Langhong;  Jiang, WG (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
Favorite  |  View/Download:49/0  |  Submit date:2018/01/10
Crystal Structure  Growth From Melt  Solid Phase Epitaxy  Alloys  
Effect of Interfacial Microstructure Evolution on Mechanical Properties and Fracture Behavior of Friction Stir-Welded Al-Cu Joints 期刊论文
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2015, 卷号: 46A, 期号: 7, 页码: 3091-3103
Authors:  Xue, P.;  Xiao, B. L.;  Ma, Z. Y.;  zyma@imr.ac.cn
Favorite  |  View/Download:28/0  |  Submit date:2016/04/21
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
Authors:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
Favorite  |  View/Download:115/0  |  Submit date:2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
Authors:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
Favorite  |  View/Download:133/0  |  Submit date:2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文
Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216
Authors:  H. Y. Liu;  Q. S. Zhu;  Z. G. Wang;  J. D. Guo;  J. K. Shang
Favorite  |  View/Download:98/0  |  Submit date:2013/12/24
Intermetallic Compound Formation  Sn-3.8ag-0.7cu Solder  Cu  Microstructure  Joints  
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process 期刊论文
Microelectronics Reliability, 2013, 卷号: 53, 期号: 6, 页码: 899-905
Authors:  P. J. Shang;  L. Zhang;  Z. Q. Liu;  J. Tan;  J. K. Shang
Favorite  |  View/Download:112/0  |  Submit date:2013/12/24
Mechanical-properties  Joints  Copper  Morphology  Tin