Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

IMR OpenIR

	Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
	Wang, Mingna; Wang, Jianqiu; Ke, Wei; Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
	2017-06-01
发表期刊	MICROELECTRONICS RELIABILITY
ISSN	0026-2714
卷号	73 页码:69-75
摘要	The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.; The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.
部门归属	[wang, mingna] hebei normal univ sci & technol, dept phys, 360 west hebei st, qinhuangdao 066004, peoples r china ; [wang, jianqiu ; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, 62 wencui rd, shenyang 110016, peoples r china
关键词	Lead-free Solder Joint Corrosion Microstructure Solidification Cracks
学科领域	Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied
资助者	National Natural Science Foundation of China (NSFC) [51601057]
收录类别	SCI
语种	英语
WOS记录号	WOS:000403512300008
引用统计	被引频次：49[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/78103
专题	中国科学院金属研究所
通讯作者	Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Mingna,Wang, Jianqiu,Ke, Wei,et al. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints[J]. MICROELECTRONICS RELIABILITY,2017,73:69-75.
APA	Wang, Mingna,Wang, Jianqiu,Ke, Wei,&Wang, MN .(2017).Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints.MICROELECTRONICS RELIABILITY,73,69-75.
MLA	Wang, Mingna,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints".MICROELECTRONICS RELIABILITY 73(2017):69-75.