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Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
Authors:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
Favorite  |  View/Download:49/0  |  Submit date:2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
Authors:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
Favorite  |  View/Download:132/0  |  Submit date:2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
Authors:  L. M. Yang;  Q. K. Zhang;  Z. F. Zhang
Favorite  |  View/Download:270/0  |  Submit date:2013/02/05
Solder Joint  Interfaces  Intermetallic Compounds  Fracture  Shear  Strength  Lead-free Solder  Brazed Joints  Size  Sn  Microstructure  Deformation  Reliability  Failure  Copper  Cu  
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2398-2404
Authors:  X. N. Du;  J. D. Guo;  J. K. Shang
Adobe PDF(656Kb)  |  Favorite  |  View/Download:307/109  |  Submit date:2012/04/13
Electromigration  Solder Joint  Intermetallic Compound  Lead-free Solders  Alloy  Interconnects  Technology  Bump