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Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
Authors:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
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Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
Authors:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
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Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
Authors:  L. M. Yang;  Q. K. Zhang;  Z. F. Zhang
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Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2398-2404
Authors:  X. N. Du;  J. D. Guo;  J. K. Shang
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