| Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging | |
| Wang, Changchang1,2; Chen, Yinbo1,2; Liu, Zhi-Quan1,2,3 | |
| Corresponding Author | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 2020-05-15 | |
| Source Publication | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| ISSN | 1006-7191 |
| Volume | 33Issue:10Pages:9 |
| Abstract | A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 degrees C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n approximate to 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress. |
| Keyword | Cu-Sn IMC Growth behavior External stress effect Isothermal aging |
| Funding Organization | National Key R&D Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission) |
| DOI | 10.1007/s40195-020-01059-3 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305501] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934] |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000533049300003 |
| Publisher | CHINESE ACAD SCIENCES, INST METAL RESEARCH |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/138791 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China |
| Recommended Citation GB/T 7714 | Wang, Changchang,Chen, Yinbo,Liu, Zhi-Quan. Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2020,33(10):9. |
| APA | Wang, Changchang,Chen, Yinbo,&Liu, Zhi-Quan.(2020).Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging.ACTA METALLURGICA SINICA-ENGLISH LETTERS,33(10),9. |
| MLA | Wang, Changchang,et al."Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging".ACTA METALLURGICA SINICA-ENGLISH LETTERS 33.10(2020):9. |
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