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CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响
Alternative TitleEffects of CuZnAl memory particles on the microstructures and properties of brass/Sn/brass solder joints
张亮1; 刘志权2; 郭永环1; 杨帆1; 钟素娟3
2018
Source Publication焊接学报
ISSN0253-360X
Volume39.0Issue:012Pages:53-57
Abstract研究了不同压力条件下(0.2N,50N)瞬时液相键合0.5%亚微米CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织和性能影响.发现0.5%亚微米CuZnAl记忆颗粒对界面组织有一定的抑制作用,主要归因于亚微米颗粒的存在减小了元素之间的扩散速率.另外相对0.2N压力条件下,50N压力下由于元素剧烈扩散易于使界面出现大量的空洞,而0.2N压力界面组织则较为均匀,并且未出现明显的空洞.力学性能结果表明,添加0.5%亚微米CuZnAl记忆颗粒,焊点的剪切力提高20%~25%.在0.2N压力、250℃保温10min,随后200℃保温1100h可以将黄铜/锡-CuZnAl/黄铜焊点完全转化为金属间化合物,并未发现明显的空洞.
Other AbstractEffects of0.5%CuZnAl memory particles on the microstructures and properties of brass/Sn/brass solder joints were investigated based on TLP bonding with0.2N and50N pressures.With the addition of0.5%CuZnAl memory particles,the interfacial reaction could be inhibited,which was attributed to the decrease of elemental diffusion at the interface.Moreover,comparing to0.2N pressure,the large amount of voids could be found under50N pressure because of strong elemental diffusion.No defects were observed in solder joints at the0.2N pressure,and the uniform microstructures were found at the interface.The shear force was enhanced by20~25%.In addition,the microstructures of the brass/Sn-CuZnAl/brass solder joints could be changed into intermetallic compounds completely under the expermental parameters(0.2N pressure,250°C(10min),200°C(1100h)),and no voids were observed.
Keyword键合瞬时液相 剪切力 压力 金属间化合物
Indexed ByCSCD
Language中文
CSCD IDCSCD:6402634
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/156808
Collection中国科学院金属研究所
Affiliation1.江苏师范大学
2.中国科学院金属研究所
3.郑州机械研究所新型钎焊材料与技术国家重点实验室
Recommended Citation
GB/T 7714
张亮,刘志权,郭永环,等. CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响[J]. 焊接学报,2018,39.0(012):53-57.
APA 张亮,刘志权,郭永环,杨帆,&钟素娟.(2018).CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响.焊接学报,39.0(012),53-57.
MLA 张亮,et al."CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响".焊接学报 39.0.012(2018):53-57.
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