| Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints | |
| Gao, Li-Yin1; Luo, Yi-Xiu2; Wan, Peng3; Liu, Zhi-Quan1,2 | |
| Corresponding Author | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
| 2021-08-01 | |
| Source Publication | MATERIALS CHARACTERIZATION
 |
| ISSN | 1044-5803 |
| Volume | 178Pages:8 |
| Abstract | The effect of Ni element on mechanical properties of FeSn2 phase was investigated by means of nano-indentation measurements and first-principles calculations. The Ni content within (Fe,Ni)Sn2 interfacial intermetallic compounds (IMCs) were controlled by using different Fe-Ni under bump metallizations (UBMs) within SnAgCu (SAC)/Fe-Ni solder joints. For SAC/Fe-45Ni (45 wt% Ni) solder joint, (Fe,Ni)Sn2 phase has coarser grains with an average amount of 1.5 at.% Ni as confirmed by scanning electron microscopy (SEM) observation and energy disperse spectroscopy (EDS). Its average Young's modulus and hardness are 134.1 GPa and 6.0 GPa respectively as measured by nano-indentation test. While for SAC/Fe-73Ni solder joints, (Fe,Ni)Sn2 phase has smaller grain size with 4.2 at.% Ni solid solution. The corresponding Young's modulus and hardness are 143.2 GPa and 6.1 GPa respectively. As further confirmed by transmission electron microscopy (TEM) and selected area electron diffraction (SAED), the (Fe,Ni)Sn2 phase possesses a crystalline of I4/mcm space group. The mechanical properties of pure FeSn2, Fe23NiSn48(about 1.5 at. % Ni) and Fe7NiSn16(about 4.2 at. % Ni) are also calculated using first principle calculation. The calculated results showed that Young's modulus increased from 134.8GPa to 139.9GPa as the Ni concentrations increased from 0 at.% to 4.2 at.%. Combining theoretical and experimental methods, we can safely conclude that the introduction of Ni element improves the Young's modulus of FeSn2 phase. However, ductility of FeSn2-based phase was the worst among the common IMCs deducing from the B/G value. And the brittleness was also confirmed by the fracture surface according to SEM observation. The brittleness of (Fe,Ni)Sn2 phase might be a risk of the reliability of SAC/Fe-Ni solder joints. |
| Keyword | Solder joint Intermetallic compound Mechanical property Nano-indentation First principle calculation |
| Funding Organization | Guangdong Basic and Applied Basic Research Fund |
| DOI | 10.1016/j.matchar.2021.111195 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | Guangdong Basic and Applied Basic Research Fund[2019A1515110771] ; Guangdong Basic and Applied Basic Research Fund[2019A1515110469] |
| WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Materials Science, Characterization & Testing |
| WOS ID | WOS:000678053400004 |
| Publisher | ELSEVIER SCIENCE INC |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/159688 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 3.Foshan Shunde Midea Elect Heating Appliances Mfg, Foshan 528311, Peoples R China |
| Recommended Citation GB/T 7714 | Gao, Li-Yin,Luo, Yi-Xiu,Wan, Peng,et al. Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints[J]. MATERIALS CHARACTERIZATION,2021,178:8. |
| APA | Gao, Li-Yin,Luo, Yi-Xiu,Wan, Peng,&Liu, Zhi-Quan.(2021).Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints.MATERIALS CHARACTERIZATION,178,8. |
| MLA | Gao, Li-Yin,et al."Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints".MATERIALS CHARACTERIZATION 178(2021):8. |
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