| Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density | |
| Zhu, Qing-Sheng1; Ding, Zi-Feng1; Wei, Xiang-Fu1; Guo, Jing-dong1; Wang, Xiao-Jing2 | |
| Corresponding Author | Zhu, Qing-Sheng(qszhu@imr.ac.cn) |
| 2023-07-01 | |
| Source Publication | MICROELECTRONICS RELIABILITY
 |
| ISSN | 0026-2714 |
| Volume | 146Pages:8 |
| Abstract | This work investigated the effects of levelers on the electroplating performance and reliability of copper pillar bumps (CPBs) on wafer. Under large current density, the usage of Janus green B (JGB) or a commercial leveler (L1) could obtain a satisfied performance in flatness, co-planarity and growth rate. It was found that this qualified leveler possessed a remarkable electrochemical characteristic, i.e., strong convection dependent adsorption (CDA). The void growth at the plated CPBs/Sn-Ag soldering interface during thermal aging was greatly accelerated when the leveler was applied during electroplating. The mass spectrum analysis showed that the level of impurities in the plated CPBs using JGB was much higher than that plated without JGB. The usage of leveler could produce a high level of impurities in the plated CPBs, which accounted for the boosting of voids at the soldering interface during thermal aging. |
| Keyword | Copper pillar bump Cu electroplating Leveler Interfacial voids Chip packaging |
| Funding Organization | Science and Technology Plan Project of Yunnan province ; National Natural Science Foundation of China (NSFC) |
| DOI | 10.1016/j.microrel.2023.115030 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | Science and Technology Plan Project of Yunnan province[202101BC070001- 007] ; National Natural Science Foundation of China (NSFC)[51471180] ; National Natural Science Foundation of China (NSFC)[51971231] |
| WOS Research Area | Engineering ; Science & Technology - Other Topics ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied |
| WOS ID | WOS:001007122600001 |
| Publisher | PERGAMON-ELSEVIER SCIENCE LTD |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/178175 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhu, Qing-Sheng |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Jiangsu Univ Sci & Technol, Coll Mat Sci & Engn, Zhenjiang 212001, Peoples R China |
| Recommended Citation GB/T 7714 | Zhu, Qing-Sheng,Ding, Zi-Feng,Wei, Xiang-Fu,et al. Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density[J]. MICROELECTRONICS RELIABILITY,2023,146:8. |
| APA | Zhu, Qing-Sheng,Ding, Zi-Feng,Wei, Xiang-Fu,Guo, Jing-dong,&Wang, Xiao-Jing.(2023).Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density.MICROELECTRONICS RELIABILITY,146,8. |
| MLA | Zhu, Qing-Sheng,et al."Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density".MICROELECTRONICS RELIABILITY 146(2023):8. |
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