Reliability and failure mechanism of copper pillar joints under current stressing

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IMR OpenIR > 中国科学院金属研究所 > 期刊论文

题名:	Reliability and failure mechanism of copper pillar joints under current stressing
作者:	Ma, Hui-Cai; Guo, Jing-Dong; Chen, Jian-Qiang; Wu, Di; Liu, Zhi-Quan; Zhu, Qing-Sheng; Shang, Jian Ku; Zhang, Li; Guo, Hong-Yan
发表日期:	2015
刊名:	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Appears in Collections:	中国科学院金属研究所_期刊论文

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Recommended Citation:

Ma, Hui-Cai,Guo, Jing-Dong,Chen, Jian-Qiang,et al. Reliability And Failure Mechanism Of Copper Pillar Joints Under Current Stressing[J]. Journal Of Materials Science-materials In Electronics,2015,26(10):7690-7697.

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