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| Reliability and failure mechanism of copper pillar joints under current stressing | |
| Ma, Hui-Cai; Guo, Jing-Dong; Chen, Jian-Qiang; Wu, Di; Liu, Zhi-Quan; Zhu, Qing-Sheng; Shang, Jian Ku; Zhang, Li; Guo, Hong-Yan; jdguo@imr.ac.cn; jkshang@imr.ac.cn | |
| 2015 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Volume | 26Issue:10Pages:7690-7697 |
| Abstract | The electromigration (EM) lifetime of copper pillars were investigated by orthogonal tests. According to the Black's mean-time-to-failure equation, the activation energy and exponent of current density were calculated to be 0.88 eV and 1.64, respectively. The microstructure evolution of the joints under current stressing was observed. It was found that the Sn solder was usually depleted before the joint failed, which means the joint was only composed of Cu6Sn5 and Cu3Sn phases as a Cu/Cu3Sn/Cu6Sn5/Cu3Sn/Cu structure after a period of EM test. Three failure modes were observed: failure along the Cu/Cu3Sn interface at the cathode side, failure along the Cu/Cu3Sn interface at the anode side and brittle fracture through the IMCs. The percentages of these three failure modes are 55, 24 and 21 %, respectively. The formation of Kirkendall voids was suggested to be the key factor for the EM failure of the Cu pillar joints. Before the Sn solder was depleted, voids were mainly formed at the Cu6Sn5/Sn interface at the cathode, which is dominated by the Cu flux induced by current; while after the Sn solder was depleted, voids formation is dominated by the chemical diffusion. |
| description.department | [ma, hui-cai ; guo, jing-dong ; chen, jian-qiang ; wu, di ; liu, zhi-quan ; zhu, qing-sheng ; shang, jian ku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [shang, jian ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa ; [zhang, li ; guo, hong-yan] jiangyin changdian adv packaging co ltd, jiangyin 214431, peoples r china |
| Funding Organization | Natural Science Foundation of China [51171191, 51101161]; National Basic Research Program of China [2010CB63 1006]; Major National Science and Technology Program of China [2011ZX02602]; National Key Scientific Instrument and Equipment Development Projects of China [2013YQ 120355]; Natural Science Foundation of Liaoning Province [2013020015] |
| Indexed By | sci |
| Language | 英语 |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/75095 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | jdguo@imr.ac.cn; jkshang@imr.ac.cn |
| Recommended Citation GB/T 7714 | Ma, Hui-Cai,Guo, Jing-Dong,Chen, Jian-Qiang,et al. Reliability and failure mechanism of copper pillar joints under current stressing[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(10):7690-7697. |
| APA | Ma, Hui-Cai.,Guo, Jing-Dong.,Chen, Jian-Qiang.,Wu, Di.,Liu, Zhi-Quan.,...&jkshang@imr.ac.cn.(2015).Reliability and failure mechanism of copper pillar joints under current stressing.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,26(10),7690-7697. |
| MLA | Ma, Hui-Cai,et al."Reliability and failure mechanism of copper pillar joints under current stressing".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 26.10(2015):7690-7697. |
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