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Insights into the atomic scale structure, bond characteristics and electrical property of Cu/CuGa2 (001) interface: an experimental and first-principles investigation 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 22, 页码: 11
作者:  Guo, Shihao;  Wang, Chen;  Wang, Li;  Chai, Zhenbang;  Chen, Yinbo;  Ma, Haitao;  Wang, Yunpeng;  Gao, Zhaoqing
收藏  |  浏览/下载：14/0  |  提交时间：2024/01/08
Effect of Cu/Ga interfacial reaction on heat transfer performance 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 17, 页码: 10
作者:  Du, Xinyu;  Wang, Wendong;  Ding, Zifeng;  Wang, Xiaojing;  Qiao, Yanxin;  Wei, Song;  Zhu, Qingsheng;  Guo, Jingdong
收藏  |  浏览/下载：7/0  |  提交时间：2024/01/07
Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 18, 页码: 16
作者:  Wang, Wendong;  Wei, Song;  Du, Xinyu;  Ding, Zifeng;  Zhu, Qingsheng;  Qiao, Yanxin;  Wang, Xiaojing;  Guo, Jingdong
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/08
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 5, 页码: 9
作者:  Bashir, M. Nasir;  Khan, Abdul Faheem;  Bashir, Shahid;  Bashir, Mohamed Bashir Ali;  Jamshaid, Muhammad;  Javed, Iqra;  Ali, Imran
收藏  |  浏览/下载：5/0  |  提交时间：2024/01/08
Large-size Ti3C2Tx microsheets for lightweight and wide-frequency microwave absorption 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 页码: 10
作者:  Wang, Xiaolei;  Han, Nan;  Zhang, Ying;  Shi, Guimei;  Zhang, Yajing;  Li, Da
收藏  |  浏览/下载：143/0  |  提交时间：2022/10/08
Self-catalytic growth and characterization of AlGaN nanostructures with high Al composition 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 页码: 9
作者:  Liu, Zitong;  Shen, Longhai;  Chen, Jianjin;  Zhang, Xinglai
收藏  |  浏览/下载：89/0  |  提交时间：2022/07/01
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：117/0  |  提交时间：2022/01/27
High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  Liu, Xiahe;  An, Xizhong
收藏  |  浏览/下载：122/0  |  提交时间：2021/11/22
Fabrication of high-conductivity RGO film at a temperature lower than 1500 degrees C by electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 10
作者:  Lv, Meijuan;  Wei, Qinwei;  Cao, Shuo;  Guo, Jingdong;  Ren, Wencai;  Cheng, Huiming
收藏  |  浏览/下载：149/0  |  提交时间：2021/10/15
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：130/0  |  提交时间：2021/03/15