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Identifying the in-situ origin of supercluster-induced ductile precipitates in Zr-based bulk metallic glasses 期刊论文
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2024, 卷号: 639, 页码: 9
作者:  Zhu, Yuhui;  Chen, Bin;  Zhou, Yongkang;  Yang, Shengli;  Zhang, Shuaifeng;  Xie, Bin;  Lv, Yifan;  Jiang, Peng;  Yu, Wei;  Zhu, Zhengwang
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Multicomponent alloys  Crystal substrate  Glass-forming droplet  High-throughput strategy  Multiscale precipitates  Structural mechanism  
Identifying the in-situ origin of supercluster-induced ductile precipitates in Zr-based bulk metallic glasses 期刊论文
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2024, 卷号: 639, 页码: 9
作者:  Zhu, Yuhui;  Chen, Bin;  Zhou, Yongkang;  Yang, Shengli;  Zhang, Shuaifeng;  Xie, Bin;  Lv, Yifan;  Jiang, Peng;  Yu, Wei;  Zhu, Zhengwang
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Multicomponent alloys  Crystal substrate  Glass-forming droplet  High-throughput strategy  Multiscale precipitates  Structural mechanism  
Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(2393Kb)  |  收藏  |  浏览/下载：104/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Lead-free Solder  Intermetallic Compounds  (Imcs)  Growth Kinetics  Local Cracks  Lead-free Solders  Electroless Ni(p) Metallization  Intermetallic  Compound  Cu-sn  Joints  Ni  Bi  Nanoindentation  Microstructure  Wt.percent  
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
作者:  H. F. Zou;  Q. S. Zhu;  Z. F. Zhang
Adobe PDF(1268Kb)  |  收藏  |  浏览/下载：79/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Sn-3.8ag-0.7cu Solder  Intermetallic  Compounds (Imcs)  Growth Kinetics  Tensile Strength  Fracture  Lead-free Solder  Interfacial Reaction  Cu-substrate  Microstructure  Metallization  Sn-3.5ag  Bump  Ni  Strength  Pb