中文版 | English

在结果中检索

IMR OpenIR

浏览/检索结果: 共17条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
High stability of Cu-doped O3-type NaNi1/3Fe1/3Mn1/3O2 cathode material for sodium-ion battery 期刊论文
IONICS, 2024, 页码: 11
作者:  Xu, Xiaojing;  Liu, Guoqiang;  Su, Chang;  Zhang, Yixuan;  Wen, Lei
收藏  |  浏览/下载：3/0  |  提交时间：2025/04/27
Cu-doping  O3-Na[Fe1/3Ni1/3Mn1/3](1-x)CuxO2  Structure stability, Air stability  
High stability of Cu-doped O3-type NaNi1/3Fe1/3Mn1/3O2 cathode material for sodium-ion battery 期刊论文
IONICS, 2024, 页码: 11
作者:  Xu, Xiaojing;  Liu, Guoqiang;  Su, Chang;  Zhang, Yixuan;  Wen, Lei
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Cu-doping  O3-Na[Fe1/3Ni1/3Mn1/3](1-x)CuxO2  Structure stability, Air stability  
Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890
作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru;  Nagao Shijo;  Suganuma Katsuaki
收藏  |  浏览/下载：146/0  |  提交时间：2021/02/02
NI SOLDER JOINTS  NANO-SCALE TWINS  INTERFACIAL RELIABILITY  FE-NI  COPPER  METALS  DEFORMATION  STRENGTH  DEPENDENCE  BOUNDARIES  Electrodeposition  Nanotwinned Cu  Growth mechanism  Acid adsorption  
Effect of doping aluminum and yttrium on high-temperature oxidation behavior of Ni-11Fe-10Cu alloy 期刊论文
JOURNAL OF RARE EARTHS, 2016, 卷号: 34, 期号: 11, 页码: 1139-1147
作者:  Cheng, XH;  Fan, L;  Liu, L;  Du, KF;  Wang, DH;  Wang, DH (reprint author), Wuhan Univ, Sch Resource & Environm Sci, Wuhan 430072, Peoples R China.
收藏  |  浏览/下载：121/0  |  提交时间：2016/12/28
Ni-fe-cu Alloy  Doping  Rare Earths  High-temperature Oxidation Behavior  Multi-layer Oxide Scale  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：103/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
作者:  H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
收藏  |  浏览/下载：143/0  |  提交时间：2013/12/24
Under-bump Metallization (Ubm)  Electroless Fe-42ni(p)  Sn  Solderability  Interfacial Reaction  Fe-p  Solderability  Deposition  Alloys  Sn  Behavior  Systems  Surface  Cu  
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494
作者:  C. Chen;  L. Zhang;  J. X. Zhao;  L. H. Cao;  J. K. Shang
收藏  |  浏览/下载：181/0  |  提交时间：2013/02/05
Solder  Size Effect  Shear Strength  Microstructure  Lead-free Solder  Fatigue-crack Initiation  Sn-ag  Fe-42ni  Ni  Cu  
Facile synthesis of supported Pt-Cu nanoparticles with surface enriched Pt as highly active cathode catalyst for proton exchange membrane fuel cells 期刊论文
International Journal of Hydrogen Energy, 2012, 卷号: 37, 期号: 23, 页码: 17978-17983
作者:  Z. Xu;  H. M. Zhang;  S. S. Liu;  B. S. Zhang;  H. X. Zhong;  D. S. Su
收藏  |  浏览/下载：164/0  |  提交时间：2013/02/05
Pt-cu  Surface Enriched Pt  Catalyst  Oxygen Reduction Reaction  Proton  Exchange Membrane Fuel Cells  Oxygen Reduction Reaction  Core-shell  Alloy Nanoparticles  Ni  Electrocatalysts  Fe  Electrochemistry  Pemfcs  
Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168
作者:  H. F. Zhou;  J. D. Guo;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2013/02/05
Electroless Fe-ni  Under-bump Metallization  Interfacial Reaction  Lead-free Solders  Wetting Balance  Snagcu Solder  Cu  Joints  Solderability  Growth  Ag  
Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文
Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238
作者:  C. Chen;  L. Zhang;  Q. Q. Lai;  C. F. Li;  J. K. Shang
Adobe PDF(398Kb)  |  收藏  |  浏览/下载：98/0  |  提交时间：2012/04/13
Thin-films  Sn-ag  Alloy  Cu  Systems  Fe-42ni  Copper  Ni  Intermetallics  Solderability