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Wettability and Interfacial Reactions Between Metallic Glass Melts and Cu/Mo Used as Roller Materials for Twin-Roll Casting 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2021, 页码: 10
作者:  Wu, Yi;  Zhang, Long;  Zhang, Hongwei;  Fu, Huameng;  Zhu, Zhengwang;  Li, Hong;  Wang, Aimin;  Zhang, Haifeng
收藏  |  浏览/下载：180/0  |  提交时间：2022/01/27
Metallic glass  Wettability  Interfacial reaction  Twin-roll casting  Roller material  
Wettability and interfacial reactions of a low Hf-containing nickel-based superalloy on Al2O3-based, SiO2-based, ZrSiO4, and CoAl2O4 substrates 期刊论文
CERAMICS INTERNATIONAL, 2020, 卷号: 46, 期号: 14, 页码: 22057-22066
作者:  Wang, Haiwei;  Yang, Jinxia;  Meng, Jie;  Yang, Yanhong;  Zhou, Yizhou
收藏  |  浏览/下载：176/0  |  提交时间：2021/02/02
Molten alloy  Ceramic substrate  Wettability  Interfacial reaction  
Improved interfacial wetability in Cu/ZnO and its role in ZnO/Cu/ZnO sandwiched transparent electrodes 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 37, 页码: 123-127
作者:  Yu, Mingshi;  Wang, Guancheng;  Zhao, Rongrong;  Liu, Enze;  Chen, Tonglai
收藏  |  浏览/下载：126/0  |  提交时间：2021/02/02
Transparent electrodes  Interfacial wettability  UV treatment  Ultra-thin copper film  
EFFECT OF C ON THE INTERFACIAL REACTION AND WETTABILITY BETWEEN A Ni-BASED SUPERALLOY AND CERAMIC MOULD 期刊论文
ACTA METALLURGICA SINICA, 2015, 卷号: 51, 期号: 7, 页码: 853-858
作者:  Chen Xiaoyan;  Jin Zhe;  Bai Xuefeng;  Zhou Yizhou;  Jin Tao;  Sun Xiaofeng
收藏  |  浏览/下载：141/0  |  提交时间：2021/02/02
superalloy  ceramic mould  interfacial reaction  wettability  activity  C  
A New Way to Improve Glass-Forming Ability by Controlling the Preparation Conditions of Bulk Metallic Glass 期刊论文
Advanced Engineering Materials, 2010, 卷号: 12, 期号: 3, 页码: 170-175
作者:  J. Mao;  H. F. Zhang;  H. M. Fu;  A. M. Wang;  H. Li;  Z. Q. Hu
Adobe PDF(330Kb)  |  收藏  |  浏览/下载：107/0  |  提交时间：2012/04/13
Supercooled Liquid Region  Ni Amorphous-alloys  Thermal-stability  Mechanical-properties  Interfacial Energies  Oxygen Impurity  Al Alloy  Crystallization  Wettability  Temperature  
Degradation of solderability of electroless nickel by phosphide particles 期刊论文
Surface & Coatings Technology, Surface & Coatings Technology, 2007, 2007, 卷号: 202, 202, 期号: 2, 页码: 268-274, 268-274
作者:  J. J. Guo;  A. P. Man;  J. K. Shang
收藏  |  浏览/下载：90/0  |  提交时间：2012/04/13
Solderability  Solderability  Electroless Nickel  Electroless Nickel  Wetting  Wetting  Pb-free Solder  Pb-free Solder  Snagcu Alloy  Snagcu Alloy  Lead-free Solders  Lead-free Solders  State Interfacial Reaction  State Interfacial Reaction  Ni-plated Kovar  Ni-plated Kovar  Ag-cu  Ag-cu  Solders  Solders  Intermetallic Compounds  Intermetallic Compounds  Mechanical-properties  Mechanical-properties  Bump  Bump  Metallization  Metallization  Microstructure  Microstructure  Copper  Copper  Wettability  Wettability