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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：142/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
In situ formation of various intermetallic particles in Al-Ti-X(Cu, Mg) systems during friction stir processing 期刊论文
Intermetallics, 2013, 卷号: 40, 页码: 36-44
作者:  Q. Zhang;  B. L. Xiao;  Z. Y. Ma
收藏  |  浏览/下载：111/0  |  提交时间：2013/12/24
Composites  Aluminides, Miscellaneous  Dispersion Strengthening  Phase  Identification  Reaction Synthesis  Aluminum-matrix Composites  Mechanical-properties  Alloys  Strength  Microstructure  Boundaries  Behavior  Phase  
Microstructural investigation of four kinds of gamma '-Fe4N nitrides in ion-nitrided pure iron 期刊论文
Journal of Materials Research, 2002, 卷号: 17, 期号: 10, 页码: 2621-2627
作者:  Z. Q. Liu;  Z. K. Hei;  D. X. Li
收藏  |  浏览/下载：65/0  |  提交时间：2012/04/14
Resolution Electron-microscopy  Phase-transformations  Tial Alloy  Nitrogen  Alpha''-fe16n2  Identification  Precipitation  Interfaces  Mechanism  Growth