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Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized CuxO Films 期刊论文
EUROPEAN JOURNAL OF INORGANIC CHEMISTRY, 2020, 卷号: 2020, 期号: 3, 页码: 261-268
作者:  Gao, Zhaoqing;  Cao, Jinwei;  Wang, Chen;  Chen, Yinbo;  Muzammal, Hussain Muhammad;  Wang, Weiqiang;  Sun, Hao;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载:158/0  |  提交时间:2021/02/02
Electrochemistry  Copper  Kinetics  Reaction rate  Surface chemistry  
Reactivity of Al-rich Alloys withWater Promoted by Liquid Al Grain Boundary Phases 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2017, 卷号: 33, 期号: 4, 页码: 397-403
作者:  He, Tiantian;  Wang, Wei;  Chen, Wei;  Chen, Demin;  Yang, Ke;  Wang, W;  Chen, DM (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载:120/0  |  提交时间:2017/08/17
Al Alloy  Microstructure  Composition  Reaction  Hydrogen Generation Rate  
How does the extent of substitution of methane with chlorine influence the mechanism and kinetics of the reactions between chloromethanes and atomic chlorine 期刊论文
KINETICS AND CATALYSIS, 2016, 卷号: 57, 期号: 2, 页码: 145-153
作者:  Yu, A. Y.;  Hu, Q. M.;  Yang, R.;  Yu, AY (reprint author), Chinese Acad Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载:94/0  |  提交时间:2016/08/22
Rate Coefficients  Variational Transition State Theory  Hydrogen Abstraction  Reaction Pathway  
Characteristics of gas explosion flow fields in complex pipelines 期刊论文
International Journal of Mining Science and Technology, 2015, 卷号: 25, 期号: 1, 页码: 157-164
作者:  Zhu Zhao;  Jia Zhenyuan;  Luo Haizhu
收藏  |  浏览/下载:83/0  |  提交时间:2021/02/26
Explosion  Numerical simulation  Acceleration  Reaction rate  
Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 485, 期号: 1-2, 页码: 853-861
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2505Kb)  |  收藏  |  浏览/下载:69/0  |  提交时间:2012/04/13
Sn-4ag Solder  Interfacial Imcs  Tensile Properties  Strain Rate  Fracture Mechanism  Lead-free Solders  Sn-ag  Shear-strength  Tensile Properties  Intermetallic Compound  Deformation-behavior  Strain-rate  Interfacial  Reaction  Cu Substrate  Microstructure