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Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
收藏  |  浏览/下载:100/0  |  提交时间:2012/04/13
Crack-growth-behavior  Lead-free Solders  Alpha-al2o3(0001)/cu(111)  Interface  Mechanical Strength  Reactive Interface  Molecular-dynamics  Joints  Cu3sn  Cu  1st-principles  
First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062
作者:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
Adobe PDF(1171Kb)  |  收藏  |  浏览/下载:85/0  |  提交时间:2012/04/13
First-principles Calculation  Segregation  Bismuth  Interface  Snbi  Solder  Reactive Interface  Cu3sn  Cu  Growth  Principles  Fracture  Crystal  Bismuth  Joints  Copper  
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2579-2584
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
Adobe PDF(349Kb)  |  收藏  |  浏览/下载:83/0  |  提交时间:2012/04/13
Intermetallic Compound (Imc)  Snbi Solder  Interface  Diffusion  Growth  Mechanism  Reactive Interface  Solder Joints  Molten Sn  Cu-sn  Technology  Kinetics  
Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates 期刊论文
Acta Materialia, 2009, 卷号: 57, 期号: 16, 页码: 4697-4706
作者:  P. J. Shang;  Z. Q. Liu;  X. Y. Pang;  D. X. Li;  J. K. Shang
Adobe PDF(714Kb)  |  收藏  |  浏览/下载:135/0  |  提交时间:2012/04/13
Cu(3)Sn  Growth Mechanism  Interface  Soldering  Transmission Electron  Microscopy  Solder Joints  Interfacial Reactions  Intermetallic Growth  Reactive  Interface  Diffusion Couples  Molten Sn  Temperature  Technology  Copper  Layers  
Theoretical studies of solid-solid interfaces 期刊论文
Current Opinion in Solid State & Materials Science, 2006, 卷号: 10, 期号: 1, 页码: 26-32
作者:  S. Q. Wang;  H. Q. Ye
收藏  |  浏览/下载:146/0  |  提交时间:2012/04/14
Solid/solid Interfaces  Interface Cohesion  Interface  Mechanics/thermodynamics  Computation And Simulation  Molecular-dynamics Simulation  Metal-ceramic Interface  Reactive  Force-field  Grain-boundary  Cu(111)/alpha-al2o3(0001) Interface  Structural Disorder  1st Principles  Adhesion  1st-principles  Potentials