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Void Nucleation and Growth from Heterophases and the Exploitation of New Toughening Mechanisms in Metals 期刊论文
CRYSTALS, 2023, 卷号: 13, 期号: 6, 页码: 31
作者:  Guo, Yi;  Paramatmuni, Chaitanya;  Avcu, Egemen
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/07
strength and ductility  void nucleation and growth  hydrostatic pressure  toughening  
Critical Inclusion Size and Void Growth in Dual-Phase Ferrite-Bainite Steel During Ductile Fracture 期刊论文
ACTA METALLURGICA SINICA, 2023, 卷号: 59, 期号: 5, 页码: 611-622
作者:  Zhao Yafeng;  Liu Sujie;  Chen Yun;  Ma Hui;  Ma Guangcai;  Guo Yi
收藏  |  浏览/下载：10/0  |  提交时间：2024/01/07
dual-phase ferrite-bainite steel  void nucleation and growth  3D-EBSD  X-ray computed tomography  size effect  
4D imaging of void nucleation, growth, and coalescence from large and small inclusions in steel under tensile deformation 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2022, 卷号: 123, 页码: 168-176
作者:  Guo, Yi;  Burnett, Timothy L.;  McDonald, Samuel A.;  Daly, Michael;  Sherry, Andrew H.;  Withers, Philip J.
收藏  |  浏览/下载：107/0  |  提交时间：2022/07/01
Void growth  Ductile fracture  Synchrotron X-ray tomography  4D imaging  Bainitic steel  
Crack propagation mechanisms of AISI 4340 steels with different strength and toughness 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 729, 页码: 130-140
作者:  Li, H. F.;  Wang, S. G.;  Zhang, P.;  Qu, R. T.;  Zhang, Z. F.
收藏  |  浏览/下载：106/0  |  提交时间：2021/02/02
Crack propagation  X-ray tomography  Fracture toughness  Cleavage fracture  Void growth and coalescence  
Crack propagation mechanisms of AISI 4340 steels with different strength and toughness 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 729, 页码: 130-140
作者:  Li, H. F.;  Wang, S. G.;  Zhang, P.;  Qu, R. T.;  Zhang, Z. F.
收藏  |  浏览/下载：99/0  |  提交时间：2021/02/02
Crack propagation  X-ray tomography  Fracture toughness  Cleavage fracture  Void growth and coalescence  
Mechanical response of Ti-based bulk metallic glass under plate-impact compression 期刊论文
INTERMETALLICS, 2015, 卷号: 63, 页码: 12-18
作者:  Wang, B. P.;  Wang, L.;  Wang, S.;  Fan, Q. B.;  Xue, Y. F.;  Zhang, H. F.;  Fu, H. M.;  xueyunfei@bit.edu.cn
收藏  |  浏览/下载：106/0  |  提交时间：2016/04/21
Metallic Glasses  Mechanical Properties  Void Formation And Growth  Deformation Map  Free Volume  Microstructure  
In situ electron microscopy investigation of void healing in an Al-Mg-Er alloy at a low temperature 期刊论文
Acta Materialia, 2014, 卷号: 69, 页码: 236-245
作者:  M. Song;  K. Du;  S. P. Wen;  Z. R. Nie;  H. Q. Ye
收藏  |  浏览/下载：176/0  |  提交时间：2014/07/03
In Situ  Al-mg-er Alloy  Void Healing  Transmission Electron Microscopy  (Tem)  Electron Tomography  Fatigue-strength  Shape Evolution  Shrinkage  Diffusion  Behavior  Growth  Grain  Model  Stability  Ceramics  
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
作者:  F. F. Tian;  P. J. Shang;  Z. Q. Liu
收藏  |  浏览/下载：194/0  |  提交时间：2014/07/03
Interfaces  Intermetallic Alloys And Compounds  Diffusion  Kirkendall  Void  Snin Solder  Cu Substrate  Growth-kinetics  Snagcu Solder  Diffusion  Compound  Identification  Ni  
Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文
Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
收藏  |  浏览/下载：85/0  |  提交时间：2012/04/13
Diffusion  Intermetallic Compounds  Snin Solder  Interfaces  Kirkendall  Void  Cu-sn  Interface  Reliability  Diffusion  Systems  Growth  
Comparison of cohesive zone parameters and crack tip stress states between two different specimen types 期刊论文
International Journal of Fracture, 2005, 卷号: 132, 期号: 2, 页码: 135-152
作者:  C. R. Chen;  O. Kolednik
收藏  |  浏览/下载：71/0  |  提交时间：2012/04/14
Cohesive Zone Model  Crack Growth Resistance  Crack Tip Constraint  Fracture Process Zone  Micro-ductile Fracture  Thin Aluminum Panels  Ductile Fracture  Growth Resistance  Void  Nucleation  Model  Separation  Predictions  Interface  Elements  Work