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Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：175/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：141/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling 期刊论文
ACTA METALLURGICA SINICA, 2006, 卷号: 42, 期号: 6, 页码: 647-652
作者:  Wang, W;  Wang, ZG;  Xian, AP;  Shang, JK
收藏  |  浏览/下载：121/0  |  提交时间：2021/02/02
Pb-free solder  interconnect  ceramic ball grid array (CBGA)  finite element method  thermal cycling