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Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System 期刊论文
ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 12, 页码: 1645-1654
Authors:  Zhou Lijun;  Wei Song;  Guo Jingdong;  Sun Fangyuan;  Wang Xinwei;  Tang Dawei
Favorite  |  View/Download：7/0  |  Submit date：2023/05/09
femtosecond laser  time-domain thermoreflectance  intermetallic compounds  thermal conductivity  
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
Authors:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
Favorite  |  View/Download：6/0  |  Submit date：2023/05/09
Thermal properties  Microstructural analysis  Vacuum infusion  Particle-reinforcement  
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
Authors:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
Favorite  |  View/Download：9/0  |  Submit date：2023/05/09
Thermal properties  Microstructural analysis  Vacuum infusion  Particle-reinforcement  
Controlling the Residual Stress in Metallic Solids by Pulsed Electric Current 期刊论文
ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 5, 页码: 581-598
Authors:  Zhang Xinfang;  Xiang Siqi;  Yi Kun;  Guo Jingdong
Favorite  |  View/Download：54/0  |  Submit date：2022/07/01
high energy pulsed electric current  low energy continuous pulsed electric current  residual stress  electroplasticity  multi-field coupling  
Fabrication of high-conductivity RGO film at a temperature lower than 1500 degrees C by electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 10
Authors:  Lv, Meijuan;  Wei, Qinwei;  Cao, Shuo;  Guo, Jingdong;  Ren, Wencai;  Cheng, Huiming
Favorite  |  View/Download：98/0  |  Submit date：2021/10/15
Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
Authors:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
Favorite  |  View/Download：88/0  |  Submit date：2021/02/02
Solderability  Electroless FeP  SnAgCu  Oxidation  
A new insight into promotion action of Co2+ in Ni-diamond composite electrodeposition 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 8, 页码: 1797-1802
Authors:  Zhou, Haifei;  Du, Nan;  Guo, Jingdong;  Liu, Shuan
Favorite  |  View/Download：66/0  |  Submit date：2021/02/02
Cobalt sulfate  Composite electrodeposition  Ni-diamond  Zero charge potential  Particle content in deposits  
A new insight into promotion action of Co2+ in Ni-diamond composite electrodeposition 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 8, 页码: 1797-1802
Authors:  Zhou, Haifei;  Du, Nan;  Guo, Jingdong;  Liu, Shuan
Favorite  |  View/Download：68/0  |  Submit date：2021/02/02
Cobalt sulfate  Composite electrodeposition  Ni-diamond  Zero charge potential  Particle content in deposits  
Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 11, 页码: 10233-10243
Authors:  Yu, Zifeng;  Wei, Song;  Guo, Jingdong
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一种定向生长的铜柱凸点互连结构及其制备方法 专利
专利类型: 发明专利, 专利号: 201410709245.1, 申请日期: 2018-04-24,
Inventors:  刘志权;  孙福龙;  李财富;  祝清省;  郭敬东
Favorite  |  View/Download：156/0  |  Submit date：2021/02/02