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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
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Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Effect of Sandblasting Treatment on the Bond Strength of the Veneering Porcelain and Zirconia All-Ceramic Crown: A Meta-Analysis 期刊论文
SCIENCE OF ADVANCED MATERIALS, 2019, 卷号: 11, 期号: 12, 页码: 1673-1683
Authors:  Yang, Qian;  Wu, Wei-Wei;  Sun, Ming-Yue;  Zhao, Li-Ang;  Babar-Shahzad, M.;  Yang, Hua-Zhe
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Zirconia All-Ceramic Crown  Sandblasting  Veneering Porcelain  Review Manager  Meta-Analysis  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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The Effect of Deformation Parameters on Advanced High Strength Steel Treated by Quenching-Partitioning-Tempering Process 期刊论文
SCIENCE OF ADVANCED MATERIALS, 2019, 卷号: 11, 期号: 7, 页码: 1044-1051
Authors:  Hao, Lu-Han;  Zhao, Wei;  Song, Jia-Rui;  Gao, Ze-Xu;  Sun, Ming-Yue;  Dong, Mengyao;  Liu, Chuntai;  Wang, Xiaojing;  Hou, Hua;  Ding, Tao;  Guo, Zhanhu
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Quenching-Partitioning-Tempering (Q-P-T)  Mechanical Property  Product of Strength and Elongation  Retained Austenite  Microstructure Characterization  
A vector-valued phase field model for polycrystalline solidification using operator splitting method 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2019, 卷号: 163, 页码: 37-49
Authors:  Ren, Jian-kun;  Chen, Yun;  Xu, Bin;  Sun, Ming-yue;  Li, Dian-zhong
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Phase field  Polycrystalline solidification  Grain boundary  Dendritic growth  Operator splitting method  Grain coarsening  
Evolution of the interfacial microstructure during the plastic deformation bonding of copper 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 746, 页码: 1-10
Authors:  Zhang, Jian Yang;  Sun, Ming Yue;  Xu, Bin;  Hu, Xin;  Liu, Sheng;  Xie, Bi Jun;  Li, Dian Zhong
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Copper bonding  Hot compression bonding  Dynamic recrystallization  Grain boundary  Dislocation wall  
锻造用钢锭超高温热送及加热过程数值模拟 期刊论文
材料热处理学报, 2018, 卷号: 39, 期号: 11, 页码: 121-128
Authors:  郭逸丰;  刘威峰;  谢海练;  徐斌;  孙明月;  李殿中
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热送  加热  温度场  有限元方法  
冷速对316H大锻件固溶处理后析出相及晶间腐蚀的影响 期刊论文
金属热处理, 2018, 卷号: 43, 期号: 10, 页码: 60-66
Authors:  邵春娟;  米国发;  许磊;  历长云;  孙明月;  徐斌
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316H钢  大锻件  晶间腐蚀  冷速  析出相