| Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder | |
| Jiang, Nan1; Zhang, Liang1; Liu, Zhi-quan2; Sun, Lei3; Xiong, Ming-yue1; Zhao, Meng1; Xu, Kai-kai1 | |
| Corresponding Author | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2019-10-01 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Volume | 30Issue:19Pages:17583-17590 |
| Abstract | In this paper, the influences of adding Titanium (Ti) nanoparticles on melting characteristics, wettability, shear properties and the growth of interfacial intermetallic compounds (IMC) of Sn58Bi solder were investigated. The results show that the addition of Ti nanoparticles improved the wettability and shear strength of Sn58Bi solder, and the optimum additive content was 0.1 wt%. The microstructure of the Sn58Bi solder was refined obviously with the addition of Ti nanoparticles. The thickness of interfacial IMC reduced significantly by adding Ti nanoparticles. However, doping Ti nanoparticles had the slight effect on the melting temperature of Sn58Bi solder. Moreover, the thickness of IMC at the Sn58Bi/Cu interface was distinctly larger than that of Sn58Bi-0.1Ti/Cu solder after multiple reflows, which means that the addition of Ti nanoparticles could suppress the growth of IMC at solder/Cu interface during multiple reflows. |
| Funding Organization | National Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project, China Postdoctoral Science Foundation ; International Cooperation Project |
| DOI | 10.1007/s10854-019-02107-0 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project, China Postdoctoral Science Foundation[2016M591464] ; International Cooperation Project[2015DFA50470] |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| WOS ID | WOS:000490120000006 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/135663 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, Liang |
| Affiliation | 1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing 210016, Jiangsu, Peoples R China |
| Recommended Citation GB/T 7714 | Jiang, Nan,Zhang, Liang,Liu, Zhi-quan,et al. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(19):17583-17590. |
| APA | Jiang, Nan.,Zhang, Liang.,Liu, Zhi-quan.,Sun, Lei.,Xiong, Ming-yue.,...&Xu, Kai-kai.(2019).Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(19),17583-17590. |
| MLA | Jiang, Nan,et al."Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.19(2019):17583-17590. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment