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Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
Jiang, Nan1; Zhang, Liang1; Liu, Zhi-quan2; Sun, Lei3; Xiong, Ming-yue1; Zhao, Meng1; Xu, Kai-kai1
Corresponding AuthorZhang, Liang(zhangliang@jsnu.edu.cn)
2019-10-01
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume30Issue:19Pages:17583-17590
AbstractIn this paper, the influences of adding Titanium (Ti) nanoparticles on melting characteristics, wettability, shear properties and the growth of interfacial intermetallic compounds (IMC) of Sn58Bi solder were investigated. The results show that the addition of Ti nanoparticles improved the wettability and shear strength of Sn58Bi solder, and the optimum additive content was 0.1 wt%. The microstructure of the Sn58Bi solder was refined obviously with the addition of Ti nanoparticles. The thickness of interfacial IMC reduced significantly by adding Ti nanoparticles. However, doping Ti nanoparticles had the slight effect on the melting temperature of Sn58Bi solder. Moreover, the thickness of IMC at the Sn58Bi/Cu interface was distinctly larger than that of Sn58Bi-0.1Ti/Cu solder after multiple reflows, which means that the addition of Ti nanoparticles could suppress the growth of IMC at solder/Cu interface during multiple reflows.
Funding OrganizationNational Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project, China Postdoctoral Science Foundation ; International Cooperation Project
DOI10.1007/s10854-019-02107-0
Indexed BySCI
Language英语
Funding ProjectNational Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project, China Postdoctoral Science Foundation[2016M591464] ; International Cooperation Project[2015DFA50470]
WOS Research AreaEngineering ; Materials Science ; Physics
WOS SubjectEngineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS IDWOS:000490120000006
PublisherSPRINGER
Citation statistics
Cited Times:9[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/135663
Collection中国科学院金属研究所
Corresponding AuthorZhang, Liang
Affiliation1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
3.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing 210016, Jiangsu, Peoples R China
Recommended Citation
GB/T 7714
Jiang, Nan,Zhang, Liang,Liu, Zhi-quan,et al. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(19):17583-17590.
APA Jiang, Nan.,Zhang, Liang.,Liu, Zhi-quan.,Sun, Lei.,Xiong, Ming-yue.,...&Xu, Kai-kai.(2019).Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(19),17583-17590.
MLA Jiang, Nan,et al."Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.19(2019):17583-17590.
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