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Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
Meng, Zhi-Chao1,2; Gao, Li-Yin3; Liu, Zhi-Quan1,2,3
Corresponding AuthorLiu, Zhi-Quan(zqliu@siat.ac.cn)
2020-05-01
Source PublicationMATERIALS CHARACTERIZATION
ISSN1044-5803
Volume163Pages:9
AbstractElectrodeposition of Sn within porous anodic aluminum oxide (AAO) template was used to synthesize Sn nanowires. Ag seed layer was sputtered upon AAO template firstly, then the Sn nanowires were electroplated upon the seed layer. After electrodeposition the Ag seed layer was removed and the AAO template was dissolved in order to obtain Sn nanowires finally. The diameter of Sn nanowires was about 200 nm, being consistent with the template pore size, while the length of nanowires had a linear growth rate of approximately 2.49 mu m/min. X-ray diffraction (XRD) and electron diffraction revealed that individual Sn nanowire was single crystal without preferential growth direction. The surface of the nanowire was wrapped by a thin SnO film (similar to 5 nm thick), as verified by transmission electron microscopy (TEM) observation and X-ray photoelectron spectrometer (XPS) analyses. The synthesized Sn nanowire powders had a dark brown color, which comes from the surface SnO layer. Through the differential scanning calorimetry (DSC) analysis, the melting point of Sn nanowires was determined as 231.73 degrees C, which is about 2.7% lower than the pure Sn particles. Fabrication of Sn nanosolders from Sn nanowires was tried using liquid bath melting method. It was found that Sn nanowires could convert into spheroidal nanosolder in liquid paraffin, which demonstrated a novel technology to fabricate nanosolders used for nanoscale interconnections.
KeywordSn nanowire Template electrodeposition Microstructural characterization Liquid bath melting Lead-free solder Melting point
Funding OrganizationNational Key Research and Development Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)
DOI10.1016/j.matchar.2020.110278
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program of China[2017YFB0305700] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934]
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Materials Science, Characterization & Testing
WOS IDWOS:000551341700050
PublisherELSEVIER SCIENCE INC
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/139913
Collection中国科学院金属研究所
Corresponding AuthorLiu, Zhi-Quan
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
Recommended Citation
GB/T 7714
Meng, Zhi-Chao,Gao, Li-Yin,Liu, Zhi-Quan. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder[J]. MATERIALS CHARACTERIZATION,2020,163:9.
APA Meng, Zhi-Chao,Gao, Li-Yin,&Liu, Zhi-Quan.(2020).Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder.MATERIALS CHARACTERIZATION,163,9.
MLA Meng, Zhi-Chao,et al."Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder".MATERIALS CHARACTERIZATION 163(2020):9.
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