Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

IMR OpenIR

	Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
	Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu; Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
	2017-08-01
发表期刊	JOURNAL OF ELECTRONIC MATERIALS
ISSN	0361-5235
卷号	46 期号:8 页码:5338-5348
摘要	Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe-xNi (x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 mu m, 1.7 mu m, and 1.4 mu m thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.; Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe-xNi (x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 mu m, 1.7 mu m, and 1.4 mu m thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.
部门归属	[gao, li-yin ; liu, zhi-quan ; li, cai-fu] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china ; [gao, li-yin ; liu, zhi-quan] univ chinese acad sci, beijing 100049, peoples r china
关键词	Fe-ni Under Bump Metallization (Ubm) Thermal Cycling Microstructural Evolution Lifetime Recrystallization Electron Backscatter Diffraction (Ebsd)
学科领域	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied
资助者	Major National Science and Technology Program of China [2011ZX02602]
收录类别	SCI
语种	英语
WOS记录号	WOS:000404530900079
引用统计	被引频次：14[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/78030
专题	中国科学院金属研究所
通讯作者	Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
推荐引用方式 GB/T 7714	Gao, Li-Yin,Liu, Zhi-Quan,Li, Cai-Fu,et al. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling[J]. JOURNAL OF ELECTRONIC MATERIALS,2017,46(8):5338-5348.
APA	Gao, Li-Yin,Liu, Zhi-Quan,Li, Cai-Fu,Liu, ZQ ,&Liu, ZQ .(2017).Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling.JOURNAL OF ELECTRONIC MATERIALS,46(8),5338-5348.
MLA	Gao, Li-Yin,et al."Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling".JOURNAL OF ELECTRONIC MATERIALS 46.8(2017):5338-5348.