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Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：108/0  |  提交时间：2021/02/02
Fe-Ni  Electrodeposition  Transmission electron microscopy (TEM)  Interfacial structure  
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：128/0  |  提交时间：2021/02/02
Fe-Ni  Electrodeposition  Transmission electron microscopy (TEM)  Interfacial structure  
In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy 期刊论文
SCRIPTA MATERIALIA, 2011, 卷号: 65, 期号: 12, 页码: 1049-1052
作者:  Li, C. F.;  Liu, Z. Q.;  Shang, P. J.;  Shang, J. K.
收藏  |  浏览/下载：93/0  |  提交时间：2021/02/02
RESn3 compounds  Oxidation  Thermodynamics  Transmission electron microscopy (TEM)  
Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface 期刊论文
MICROELECTRONICS RELIABILITY, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  Pang, X. Y.;  Liu, Z. Q.;  Wang, S. Q.;  Shang, J. K.
收藏  |  浏览/下载：102/0  |  提交时间：2021/02/02