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Toward a Slow-Release Borate Inhibitor To Control Mild Steel Corrosion in Simulated Recirculating Water 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 4, 页码: 4183-4197
作者:  Cui, J;  Yang, YG;  Li, XQ;  Yuan, WJ;  Pei, YS;  Pei, YS (reprint author), Beijing Normal Univ, Sch Environm, Minist Educ, Key Lab Water & Sediment Sci, Beijing 100875, Peoples R China.
收藏  |  浏览/下载：128/0  |  提交时间：2018/06/05
Electrochemical Impedance Spectroscopy  Ray Photoelectron-spectroscopy  Point-defect Model  3.5-percent Nacl Solution  316l Stainless-steel  Low-carbon Steel  Passive Films  Mott-schottky  Frequency-modulation  Buffer Solution  
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者:  M. N. Wang;  J. Q. Wang;  W. Ke
收藏  |  浏览/下载：113/0  |  提交时间：2014/04/18
Lead-free Solders  3.5-percent Nacl Solution  Electrochemical Corrosion  Ga Solder  Reliability  Surface  Alloys  Joints  Tin  Sn  
Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 12, 页码: 5269-5276
作者:  M. N. Wang;  J. Q. Wang;  W. Ke
收藏  |  浏览/下载：101/0  |  提交时间：2015/01/14
3.5-percent Nacl Solution  Electrochemical Corrosion  Polarization  Characteristics  Alloys  Surface  Joints  
In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655
作者:  M. N. Wang;  J. Q. Wang;  H. Feng;  W. Ke
收藏  |  浏览/下载：110/0  |  提交时间：2013/02/05
Lead-free Solder  Microstructure  Corrosion  Three-point Bending  Fracture  Electrochemical Corrosion Behavior  3.5-percent Nacl Solution  Ga  Solder  Alloys  Sn  Joints