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Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via 期刊论文
MATERIALS, 2018, 卷号: 11, 期号: 2, 页码: -
作者:  Sun, FL;  Liu, ZQ;  Li, CF;  Zhu, QS;  Zhang, H;  Suganuma, K;  Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：112/0  |  提交时间：2018/06/05
Columnar-grained Cu  Twins  Boundaries  Nanoscale  Strength  Behavior  Joints