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Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing 期刊论文
CORROSION SCIENCE, 2018, 卷号: 139, 页码: 383-394
Authors:  Wang, J;  Chen, G;  Sun, FL;  Zhou, ZX;  Liu, ZQ;  Liu, CQ
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一种定向生长的铜柱凸点互连结构及其制备方法 专利
专利类型: 发明专利, 专利号: 201410709245.1, 申请日期: 2018-04-24,
Authors:  刘志权;  孙福龙;  李财富;  祝清省;  郭敬东
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Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via 期刊论文
MATERIALS, 2018, 卷号: 11, 期号: 2, 页码: -
Authors:  Sun, FL;  Liu, ZQ;  Li, CF;  Zhu, QS;  Zhang, H;  Suganuma, K;  Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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微电子封装用纳米孪晶铜的电沉积制备及界面反应研究 学位论文
, 2018
Authors:  孙福龙
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超高强钢盒形件热冲压工艺的实验研究 期刊论文
沈阳理工大学学报, 2014, 期号: 5, 页码: 63-65+69
Authors:  孙家琦;  岳峰丽;  林涛;  王道重
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