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Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
作者:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
收藏  |  浏览/下载：110/0  |  提交时间：2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Study of the zinc electroplating process using electrochemical noise technique 期刊论文
Journal of Electroanalytical Chemistry, 2005, 卷号: 578, 期号: 2, 页码: 357-367
作者:  Z. Zhang;  W. H. Leng;  Q. Y. Cai;  F. H. Cao;  J. Q. Zhang
收藏  |  浏览/下载：105/0  |  提交时间：2012/04/14
Zinc Electroplating  Electrochemical Noise  Electrodeposit Structure  Glassy-carbon  Layered Nanostructures  Copper/cuprous Oxide  Wavelets  Transform  Electrodeposition  Nucleation  Electrocrystallization  Crystallization  Behavior  Silver