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| 304不锈钢毛细管/Zr_(53.5)Cu_(26.5)Ni_5Al_(12)Ag_3块体非晶合金复合材料的制备与性能研究 期刊论文
金属学报, 2014, 期号: 9, 页码: 1087-1094
作者: 马广财; 付华萌; 王峥; 徐庆亮; 张海峰
  收藏 | 浏览/下载：115/0 | 提交时间：2015/01/15
Zr53.5cu26.5ni5al12ag3非晶合金 304不锈钢毛细管 剪切带 加工硬化 |
| Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者: H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai
收藏 | 浏览/下载：103/0 | 提交时间：2015/01/14
Fe-ni Alloy Under Bump Metallization (Ubm) Intermetallic Compound (Imc) Reliability High Temperature Storage Temperature Cycling Lead-free Solders Intermetallic Compounds Growth-kinetics Cu Metallization Ag Strength Ball Ubm |
| Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494
作者: C. Chen; L. Zhang; J. X. Zhao; L. H. Cao; J. K. Shang
收藏 | 浏览/下载：180/0 | 提交时间：2013/02/05
Solder Size Effect Shear Strength Microstructure Lead-free Solder Fatigue-crack Initiation Sn-ag Fe-42ni Ni Cu |
| Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168
作者: H. F. Zhou; J. D. Guo; J. K. Shang
收藏 | 浏览/下载：100/0 | 提交时间：2013/02/05
Electroless Fe-ni Under-bump Metallization Interfacial Reaction Lead-free Solders Wetting Balance Snagcu Solder Cu Joints Solderability Growth Ag |
| Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文
Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238
作者: C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang
Adobe PDF(398Kb) | 收藏 | 浏览/下载：98/0 | 提交时间：2012/04/13
Thin-films Sn-ag Alloy Cu Systems Fe-42ni Copper Ni Intermetallics Solderability |
| 大块锆基非晶合金Zr_(53.5)Cu_(26.5)Ni_5Al_(12)Ag_3的盐雾腐蚀行为 期刊论文
沈阳化工学院学报, 2010, 期号: 1, 页码: 1-6
作者: 李云; 徐亮; 祁世杰; 程明; 张士宏
收藏 | 浏览/下载：93/0 | 提交时间：2012/04/12
Zr53.5cu26.5ni5al12ag3非晶合金 极化曲线 盐雾腐蚀金相显微镜 |
| Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 487, 期号: 1-2, 页码: 776-780
作者: X. F. Zhang; J. D. Guo; J. K. Shang
Adobe PDF(759Kb) | 收藏 | 浏览/下载：86/0 | 提交时间：2012/04/13
Intermetallics Kinetics Interfacial Reactions Feni Activation Energy Zn Based Solders Ni-p/au Layer Interfacial Reactions Sn-ag Cu Electromigration Interconnect Microstructure Substrate Alloys |
| Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
作者: H. F. Zou; Z. F. Zhang
Adobe PDF(2393Kb) | 收藏 | 浏览/下载：106/0 | 提交时间：2012/04/13
Ag Single Crystal Substrate Lead-free Solder Intermetallic Compounds (Imcs) Growth Kinetics Local Cracks Lead-free Solders Electroless Ni(p) Metallization Intermetallic Compound Cu-sn Joints Ni Bi Nanoindentation Microstructure Wt.percent |
| Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
作者: H. F. Zou; Q. S. Zhu; Z. F. Zhang
Adobe PDF(1268Kb) | 收藏 | 浏览/下载：79/0 | 提交时间：2012/04/13
Ag Single Crystal Substrate Sn-3.8ag-0.7cu Solder Intermetallic Compounds (Imcs) Growth Kinetics Tensile Strength Fracture Lead-free Solder Interfacial Reaction Cu-substrate Microstructure Metallization Sn-3.5ag Bump Ni Strength Pb |
| A group of Cu(Zr)-based BMGs with critical diameter in the range of 12 to 18 mm 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 2, 页码: 149-152
作者: Y. Shen; E. Ma; J. Xu
Adobe PDF(4881Kb) | 收藏 | 浏览/下载：78/0 | 提交时间：2012/04/13
Bulk Metallic Glasses Glass-forming Ability Copper Zirconium Bulk Metallic Glasses Forming Ability Cu-zr Thermal-stability Alloys Ni Plasticity Ag Ti |
