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Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 4, 页码: 4484-4496
作者:  Cheng, Qiang;  Zheng, LiLi;  Li, XiChao;  Xu, Bin;  Sun, MingYue;  Shi, Jing;  Dai, ZuoQiang;  Zhang, TieZhu;  Zhang, HongXin
收藏  |  浏览/下载：109/0  |  提交时间：2022/07/01
Solid diffusion bonding  Ti3SiC2 ceramic  SUS430  Interfacial microstructure  Growth kinetics  
Kinetics-Controlled Growth of Metallic Single-Wall Carbon Nanotubes from CoRex Nanoparticles 期刊论文
ACS NANO, 2022, 卷号: 16, 期号: 1, 页码: 232-240
作者:  Li, Xin;  Zhang, Feng;  Zhang, Lili;  Ji, Zhong-Hai;  Zhao, Yi-Ming;  Xu, Zi-Wei;  Wang, Yang;  Hou, Peng-Xiang;  Tian, Min;  Zhao, Hai-Bo;  Jiang, Song;  Ping, Lin-Quan;  Cheng, Hui-Ming;  Liu, Chang
收藏  |  浏览/下载：144/0  |  提交时间：2022/07/01
metallic single-wall carbon nanotube  controlled growth  bimetallic catalyst  kinetics  CoRe  selective mechanism  
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345
作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping
收藏  |  浏览/下载：125/0  |  提交时间：2021/02/02
Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion  
Effect of pH on corrosion behavior of 316L stainless steel in hydrogenated high temperature water 期刊论文
MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2018, 卷号: 69, 期号: 5, 页码: 580-589
作者:  Wang, JZ;  Wang, JQ;  Ming, HL;  Zhang, ZM;  Han, EH;  Wang, JZ (reprint author), Chinese Acad Sci, Inst Met Res, Key Lab Nucl Mat & Safety Assessment, 62 Wencui Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：110/0  |  提交时间：2018/06/05
Simulated Primary Water  Dissolved-oxygen Concentration  Crack-growth Kinetics  Surface Oxide-films  Pwr Primary Water  Alloy 690  Pressurized-water  Electrochemical-behavior  Aqueous Environments  Nickel-alloys  
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：130/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Deformation-assisted diffusion for the enhanced kinetics of dynamic phase transformation 期刊论文
MATERIALS RESEARCH LETTERS, 2018, 卷号: 6, 期号: 11, 页码: 641-647
作者:  Zhao, Lijia;  Park, Nokeun;  Tian, Yanzhong;  Shibata, Akinobu;  Tsuji, Nobuhiro
收藏  |  浏览/下载：137/0  |  提交时间：2021/02/02
Dynamic phase transformation  deformation  diffusion  kinetics  grain growth  
Deformation-assisted diffusion for the enhanced kinetics of dynamic phase transformation 期刊论文
MATERIALS RESEARCH LETTERS, 2018, 卷号: 6, 期号: 11, 页码: 641-647
作者:  Zhao, Lijia;  Park, Nokeun;  Tian, Yanzhong;  Shibata, Akinobu;  Tsuji, Nobuhiro
收藏  |  浏览/下载：139/0  |  提交时间：2021/02/02
Dynamic phase transformation  deformation  diffusion  kinetics  grain growth  
Phase-field modeling of Widmanstatten ferrite formation during isothermal transformation in low carbon steels 期刊论文
Computational Materials Science, 2014, 卷号: 81, 页码: 503-509
作者:  W. Yan;  N. M. Xiao;  Y. Chen;  D. Z. Li
收藏  |  浏览/下载：141/0  |  提交时间：2014/02/19
Phase-field Modeling  Widmanstatten Ferrite  Morphological Instability  Al-cu Alloy  Fe-c  Directional Solidification  Binary-alloys  Growth  Kinetics  Diffusion  Simulation  Plates  Austenite  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：140/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Effects of heterogeneity on recrystallization kinetics of nanocrystalline copper prepared by dynamic plastic deformation 期刊论文
Acta Materialia, 2014, 卷号: 72, 页码: 252-261
作者:  F. X. Lin;  Y. B. Zhang;  N. R. Tao;  W. Pantleon;  D. J. Jensen
收藏  |  浏览/下载：107/0  |  提交时间：2014/07/03
Nanocrystalline Metal  Recrystallization Kinetics  Dynamic Plastic  Deformation (Dpd)  Copper  Mechanical Properties  Stored Energy  Modeling Recrystallization  Mechanical-properties  Computer-simulation  Deformed Metals  Phase-change  Microstructure  Nucleation  Cu  Growth