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| Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890
作者: Sun FuLong; Gao LiYin; Liu ZhiQuan; Zhang Hao; Sugahara Tohru; Nagao Shijo; Suganuma Katsuaki
  收藏 | 浏览/下载：146/0 | 提交时间：2021/02/02
NI SOLDER JOINTS NANO-SCALE TWINS INTERFACIAL RELIABILITY FE-NI COPPER METALS DEFORMATION STRENGTH DEPENDENCE BOUNDARIES Electrodeposition Nanotwinned Cu Growth mechanism Acid adsorption |
| Magnetic effect on the interfacial energy of the Ni(111)/Cr(110) interface 期刊论文
Journal of Physics-Condensed Matter, 2014, 卷号: 26, 期号: 35
作者: S. Lu; H. L. Zhang; Q. M. Hu; M. P. J. Punkkinen; B. Johansson; L. Vitos
收藏 | 浏览/下载：178/0 | 提交时间：2015/01/14
Ni/cr Interface Interfacial Energy Work Of Separation Ab Initio Ni-cr Alloy Augmented-wave Method Fcc-bcc Boundaries Ab-initio Crystallography Simulation Morphology Metals Misfit Shape |
| Effect of crystallographic orientation and grain boundary character on fatigue cracking behaviors of coaxial copper bicrystals 期刊论文
Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 425-438
作者: L. L. Li; P. Zhang; Z. J. Zhang; Z. F. Zhang
收藏 | 浏览/下载：120/0 | 提交时间：2013/12/24
Copper Bicrystal Interfacial Energy Crystallographic Orientation Grain Boundary Twin Boundary Cyclic Deformation-behavior Persistent Slip Bands Structure-energy Correlation Centered-cubic Metals Stage-i Propagation High Strain Fatigue Low-alloy Steel Transfer Mechanisms Single-crystals Twin Boundaries |
| Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者: H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：118/0 | 提交时间：2013/02/05
Sn-bi Solder Void Cu3sn Bi Segregation Interfacial Embrittlement Cu Alloys Solder Interconnect Grain-boundaries Single-crystal Bismuth Embrittlement Segregation Copper Strength |
| Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate 期刊论文
Journal of Materials Research, 2010, 卷号: 25, 期号: 2, 页码: 303-314
作者: Q. K. Zhang; H. F. Zou; Z. F. Zhang
Adobe PDF(2455Kb) | 收藏 | 浏览/下载：123/0 | 提交时间：2012/04/13
Interfacial Embrittlement Mechanical-properties Grain-boundaries Sn-3.5ag Solders Bismuth Solder Copper Segregation Metallization Interconnect Strength |
| High-resolution image simulation of overlap structures in TiAl alloy 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 468, 期号: 1-2, 页码: 179-186
作者: C. L. Chen; W. Lu; Y. Y. Cui; L. L. He; H. Q. Ye
Adobe PDF(1497Kb) | 收藏 | 浏览/下载：121/0 | 提交时间：2012/04/13
Intermetallics Scanning And Transmission Electron Microscopy Crystal Structural And Symmetry Gamma-titanium Aluminides Transmission Electron-microscopy Deformed Ti-45al-10nb Alloy Mechanical-properties Lamellar Microstructure Interfacial Boundaries Intermetallic Alloys Stacking-faults Creep-behavior Pst Crystals |
| Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate 期刊论文
Scripta Materialia, 2009, 卷号: 61, 期号: 3, 页码: 308-311
作者: H. F. Zou; Q. K. Zhang; Z. F. Zhang
Adobe PDF(352Kb) | 收藏 | 浏览/下载：71/0 | 提交时间：2012/04/13
Bi Interfacial Segregation Embrittlement Pb-free Solder Interfacial Strength Soldering Copper Grain-boundaries Fracture Boron Chemistry Ni3al |
| Molecular dynamics study on interfacial energy and atomic structure of Ag/Ni and Cu/Ni heterophase system 期刊论文
Journal of Materials Science & Technology, 2004, 卷号: 20, 期号: 6, 页码: 644-648
作者: H. J. Liu; S. Q. Wang; A. Du; C. B. Zhang
收藏 | 浏览/下载：96/0 | 提交时间：2012/04/14
Molecular Dynamics Interfacial Energy Atomic Structure Heterophase Boundary Fcc Metals Model Boundaries Liquid Nickel |
| TEM observations of mechanical twins in a hot-deformed Ti-45Al-10Nb alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 1998, 1998, 卷号: 252, 252, 期号: 2, 页码: 222-231, 222-231
作者: J. G. Wang; L. C. Zhang; G. L. Chen; H. Q. Ye
收藏 | 浏览/下载：69/0 | 提交时间：2012/04/14
Intermetallic Compounds Intermetallic Compounds Tial Alloys Tial Alloys Mechanical Twinning Mechanical Twinning Tem Tem Resolution Electron-microscopy Resolution Electron-microscopy Interfacial Boundaries Interfacial Boundaries Deformation Deformation Twins Twins Intersections Intersections Temperatures Temperatures Propagation Propagation Aluminides Aluminides Ti Ti |
| Stress-induced phase transformations in a hot-deformed two-phase (alpha(2)+gamma) TiAl alloy 期刊论文
Journal of Materials Science, 1998, 卷号: 33, 期号: 10, 页码: 2563-2571
作者: J. G. Wang; L. C. Zhang; G. L. Chen; H. Q. Ye
收藏 | 浏览/下载：81/0 | 提交时间：2012/04/14
Transmission Electron-microscopy Gamma-titanium Aluminides Interfacial Boundaries Intermetallic Alloys Ti-45al-10nb Alloy Base Alloys Deformation |
