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Improving mechanical properties of dissimilar TA3/L907A steel clad plates with multiple interlayers via hot-compression bonding 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2025, 卷号: 36, 页码: 111-122
作者:  Xiao, He;  Liu, Weifeng;  Dai, Qianning;  Ren, Shaofei;  Xu, Bin;  Wu, Shengqing;  Liu, Sheng;  Sun, Mingyue
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Ti/steel bonding  Interlayer  Interfacial strength  Intermetallic compounds (IMCs)  Hot-compression bonding(HCB)  
Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 485, 期号: 1-2, 页码: 853-861
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2505Kb)  |  收藏  |  浏览/下载：70/0  |  提交时间：2012/04/13
Sn-4ag Solder  Interfacial Imcs  Tensile Properties  Strain Rate  Fracture Mechanism  Lead-free Solders  Sn-ag  Shear-strength  Tensile Properties  Intermetallic Compound  Deformation-behavior  Strain-rate  Interfacial  Reaction  Cu Substrate  Microstructure  
Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文
Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662
作者:  H. F. Zou;  H. J. Yang;  Z. F. Zhang
Adobe PDF(4272Kb)  |  收藏  |  浏览/下载：105/0  |  提交时间：2012/04/13
Cu Single Crystal  Orientation  Intermetallic Compounds (Imcs)  Coarsening Mechanism  Growth Kinetics  Lead-free Solders  Interfacial Reactions  Eutectic Snpb  Joints  Microstructure  Sn-3.5ag  Sn-0.7cu  Copper  
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
作者:  H. F. Zou;  Q. S. Zhu;  Z. F. Zhang
Adobe PDF(1268Kb)  |  收藏  |  浏览/下载：79/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Sn-3.8ag-0.7cu Solder  Intermetallic  Compounds (Imcs)  Growth Kinetics  Tensile Strength  Fracture  Lead-free Solder  Interfacial Reaction  Cu-substrate  Microstructure  Metallization  Sn-3.5ag  Bump  Ni  Strength  Pb