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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：136/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：103/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging 期刊论文
Microscopy and Microanalysis, 2013, 卷号: 19, 页码: 105-108
作者:  Z. Q. Liu;  P. J. Shang;  F. F. Tan;  D. X. Li
收藏  |  浏览/下载：195/0  |  提交时间：2014/04/18
Lead-free Solder  Kirkendall Void  Intermetallic Compound (Imc)  Diffusion  Interface  Transmission Electron Microscopy (Tem)  Cu  
Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 7, 页码: 1542-1548
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(520Kb)  |  收藏  |  浏览/下载：100/0  |  提交时间：2012/04/13
Cu(3)Sn  Void  Cu Alloys  Intermetallic Compound (Imc)  Interfacial  Reaction  Free Solders  Mechanisms  Diffusion  Strength  Joints  
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2579-2584
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
Adobe PDF(349Kb)  |  收藏  |  浏览/下载：83/0  |  提交时间：2012/04/13
Intermetallic Compound (Imc)  Snbi Solder  Interface  Diffusion  Growth  Mechanism  Reactive Interface  Solder Joints  Molten Sn  Cu-sn  Technology  Kinetics