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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：143/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
作者:  F. F. Tian;  P. J. Shang;  Z. Q. Liu
收藏  |  浏览/下载：196/0  |  提交时间：2014/07/03
Interfaces  Intermetallic Alloys And Compounds  Diffusion  Kirkendall  Void  Snin Solder  Cu Substrate  Growth-kinetics  Snagcu Solder  Diffusion  Compound  Identification  Ni  
Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文
Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
收藏  |  浏览/下载：86/0  |  提交时间：2012/04/13
Diffusion  Intermetallic Compounds  Snin Solder  Interfaces  Kirkendall  Void  Cu-sn  Interface  Reliability  Diffusion  Systems  Growth