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| Residual Stress Evolution and Its Mechanism During the Manufacture of Superalloy Disk Forgings 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 9, 页码: 1160-1174
作者: Bi Zhongnan; Qin Hailong; Dong Zhiguo; Wang Xiangping; Wang Ming; Liu Yongquan; Du Jinhui; Zhang Ji
  收藏 | 浏览/下载：171/0 | 提交时间：2021/02/02
TEMPERATURE STRUCTURE STABILITY SITU NEUTRON-DIFFRACTION IN-SITU SINGLE-CRYSTAL CREEP-BEHAVIOR TURBINE DISC INCONEL 718 RELAXATION MICROSTRUCTURE DISTORTION superalloy residual stress neutron diffraction contour method turbine disk |
| Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者: Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：107/0 | 提交时间：2013/12/24
Sn-ag/cu Solder Joints Thermal Fatigue Strain Localization Grain Rotation Dynamic Recovery Stress-relaxation Behavior Eutectic Sn-3.5ag Solder Lead-free Solders Pb-free Solders Sn-ag Tensile Properties Shear-strength Fracture-behavior Deformation Creep |
| In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 3, 页码: 289-292
作者: Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：133/0 | 提交时间：2013/02/05
Sn-4ag Solder In Situ Tensile Creep Electron Backscatter Diffraction (Ebsd) Polygonization Grains Subdivision Sn-ag Stress-relaxation Fracture-behavior Thermal Fatigue Deformation Grain Recrystallization Microstructure Orientation Evolution |
| Evolution of interfacial nanostructures and stress states in Mg matrix composites reinforced with coated continuous carbon fibers 期刊论文
Composites Science and Technology, 2012, 卷号: 72, 期号: 2, 页码: 152-158
作者: W. G. Wang; B. L. Xiao; Z. Y. Ma
收藏 | 浏览/下载：111/0 | 提交时间：2013/02/05
Metal-matrix Composites (Mmcs) Carbon Fibers Sol-gel Methods Interface Stress Relaxation Transverse Tensile Behavior Thermal Residual-stresses Sicf/ti-6al-4v Composites Nanocrystalline Ceramics Graphite-fiber Zro2 Film Zirconia Phase Transformation Magnesium |
| Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 3, 页码: 1467-1471
作者: H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. K. Shang
Adobe PDF(969Kb) | 收藏 | 浏览/下载：111/0 | 提交时间：2012/04/13
Electromigration Groove Stress Relaxation Grain Boundary Diffusion Tin Single Crystals Creep-behavior Solder Joints Electromigration Ag Microstructure Deformation |
| Effect of temperature on residual stress and mechanical properties of Ti films prepared by both ion implantation and ion beam assisted deposition 期刊论文
Applied Surface Science, 2009, 卷号: 255, 期号: 8, 页码: 4484-4490
作者: Y. He; J. Z. Zhang; W. Q. Yao; D. X. Li; X. Teng
Adobe PDF(1333Kb) | 收藏 | 浏览/下载：96/0 | 提交时间：2012/04/13
Titanium Residual Stress Mevva Ibad Nanohardness Xrd Shape-memory Alloy Tribological Properties Silicon Relaxation Aluminum Behavior |
| High temperature creep deformation of an Al-Fe-V-Si alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 1999, 卷号: 259, 期号: 1, 页码: 25-33
作者: L. M. Peng; S. J. Zhu; Z. Y. Ma; J. Bi; H. R. Chen; F. G. Wang
收藏 | 浏览/下载：77/0 | 提交时间：2012/04/14
Dispersion-strengthened Aluminum Alloys Creep Stress Exponent Activation Energy Threshold Stress Dislocation Detachment Relaxation Parameter Dislocation Climb Matrix Composites Powder-metallurgy Threshold Stress Behavior Aluminum Particles Strength Model |
